Modern data centers increasingly rely on interconnects for delivering critical communications connectivity among numerous servers, memory, and computation resources. Data center interconnects turned to optical communications almost a decade ago, and the recent acceleration in data center requirements is expected to further drive photonic interconnect technologies deeper into the systems architecture. This review paper analyzes optical technologies that will enable next-generation data center optical interconnects. Recent progress addressing the challenges of terabit/s links and networks at the laser, modulator, photodiode, and switch levels is reported and summarized.

The proliferation of Internet-of-Things has promoted a wide variety of emerging applications that require compact, lightweight, and low-cost optical spectrometers. While substantial progresses have been made in the miniaturization of spectrometers, most of them are with a major focus on the technical side but tend to feature a lower technology readiness level for manufacturability. More importantly, in spite of the advancement in miniaturized spectrometers, their performance and the metrics of real-life applications have seldomly been connected but are highly important. This review paper shows the market trend for chip-scale spectrometers and analyzes the key metrics that are required to adopt miniaturized spectrometers in real-life applications. Recent progress addressing the challenges of miniaturization of spectrometers is summarized, paying a special attention to the CMOS-compatible fabrication platform that shows a clear pathway to massive production. Insights for ways forward are also presented.

The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs and limited ‘chip-escape’ bandwidth densities, is perhaps the singular factor determining the scalability of future systems. Using light to send information between compute nodes in such systems can dramatically increase the available bandwidth while simultaneously decreasing energy consumption. Through wavelength-division multiplexing with chip-based microresonator Kerr frequency combs, independent information channels can be encoded onto many distinct colours of light in the same optical fibre for massively parallel data transmission with low energy. Although previous high-bandwidth demonstrations have relied on benchtop equipment for filtering and modulating Kerr comb wavelength channels, data-centre interconnects require a compact on-chip form factor for these operations. Here we demonstrate a massively scalable chip-based silicon photonic data link using a Kerr comb source enabled by a new link architecture and experimentally show aggregate single-fibre data transmission of 512 Gb s⁻¹ across 32 independent wavelength channels. The demonstrated architecture is fundamentally scalable to hundreds of wavelength channels, enabling massively parallel terabit-scale optical interconnects for future green hyperscale data centres.

Photonic switches are increasingly considered for insertion in high performance datacenter architectures to meet the growing performance demands of interconnection networks. We provide an overview of photonic switching technologies and develop an evaluation methodology for assessing their potential impact on datacenter performance. We begin with a review of three categories of optical switches, namely, free-space switches, III-V integrated switches and silicon integrated switches. The state-of-the-art of MEMS, LCOS, SOA, MZI and MRR switching technologies are covered, together with insights on their performance limitations and scalability considerations. The performance metrics that are required for optical switches to truly emerge in datacenters are discussed and summarized, with special focus on the switching time, cost, power consumption, scalability and optical power penalty. Furthermore, the Pareto front of the switch metric space is analyzed. Finally, we propose a hybrid integrated switch fabric design using the III-V/Si wafer bonding technique and investigate its potential impact on realizing reduced cost and power penalty.

Optical spectroscopic sensors are a powerful tool to reveal light-matter interactions in many fields. Miniaturizing the currently bulky spectrometers has become imperative for the wide range of applications that demand in situ or even in vitro characterization systems, a field that is growing rapidly. In this paper, we propose a novel integrated reconstructive spectrometer with programmable photonic circuits by simply using a few engineered MZI elements. This design effectively creates an exponentially scalable number of uncorrelated sampling channels over an ultra-broad bandwidth without incurring additional hardware costs, enabling ultra-high resolution down to single-digit picometers. Experimentally, we implement an on-chip spectrometer with a 6-stage cascaded MZI structure and demonstrate 200 nm bandwidth using only 729 sampling channels. This achieves a bandwidth-to-resolution ratio of over 20,000, which is, to our best knowledge, about one order of magnitude greater than any reported miniaturized spectrometers to date.

Miniaturization of optical spectrometers is important to enable spectroscopic analysis to play a role in in situ, or even in vitro and in vivo characterization systems. However, scaled-down spectrometers generally exhibit a strong trade-off between spectral resolution and operating bandwidth, and are often engineered to identify signature spectral peaks only for specific applications. In this paper, we propose and demonstrate a novel global sampling strategy with distributed filters for generating ultra-broadband pseudo-random spectral responses. The geometry of all-pass ring filters is tailored to ensure small self- and cross-correlation for effective information acquisition across the whole spectrum, which dramatically reduces the requirement on sampling channels. We employ the power of reconfigurable photonics in spectrum shaping by embedding the engineered distributed filters. Using a moderate mesh of MZIs, we create 256 diverse spectral responses on a single chip and demonstrate a resolution of 20 pm for single spectral lines and 30 pm for dual spectral lines over a broad bandwidth of 115 nm, to the best of our knowledge achieving a new record of bandwidth-to-resolution ratio. Rigorous simulations reveal that this design will readily be able to achieve single-picometer-scale resolution. We further show that the reconfigurable photonics provides an extra degree of programmability, enabling user-defined features on resolution, computation complexity, and relative error. The use of SiN integration platform enables the spectrometer to exhibit excellent thermal stability of ±2.0 °C, effectively tackling the challenge of temperature variations at picometer-scale resolutions.