Flexible conductive structures are essential for the fabrication of commercial integrated electronic devices. Developing efficient processes for manufacturing these structures with high conductivity and stability is significant. Based on a modifiable cost-effective Cu-based ionic liquid precursor, here we present an in situ laser patterning technique to manufacture flexible electrodes. The fabricated Cu structure has excellent conductivity, approximately comparable to bulk Cu, while its oxidation resistance could be further enhanced through introducing an additional carbon source to form a Cu@C microstructure. The chemical and electrical stabilities are evaluated. This method provides a possible bottom-up route for manufacturing microelectronic devices in one step, as we demonstrated through a flexible heater.