Low noise platinum black or sputtered titanium nitride (TiN) microelectrodes are typically used for recording electrical activity of neuronal or cardiac cell cultures. Opaque electrodes and tracks, however, hinder the visibility of the cells when imaged with inverted microscope, which is the standard method of imaging cells plated on microelectrode array (MEA). Even though transparent indium tin oxide (ITO) electrodes exist, they cannot compete in impedance and noise performance with above-mentioned opaque counterparts. In this work, we propose atomic layer deposition (ALD) as the method to deposit TiN electrodes and tracks which are thin enough (25–65 nm) to be transparent (transmission ∼18–45%), but still benefit from the columnar structure of TiN, which is the key element to decrease noise and impedance of the electrodes. For ALD TiN electrodes (diameter 30 μm) impedances from 510 to 590 kΩ were measured at 1 kHz, which is less than the impedance of bare ITO electrodes. Human induced pluripotent stem cell (hiPSC)-derived cortical neurons were cultured on the ALD TiN MEAs for 14 days without observing any biocompatibility issues, and spontaneous electrical activity of the neurons was recorded successfully. The results show that transparent ALD TiN film is a suitable electrode material for producing functional MEAs.

We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips, and is a first step toward more complex quantum devices with three-dimensional integration.

Temperatures below 1 mK on-chip hold great potential for quantum physics but present a great challenge due to the lack of suitable thermometry and the detrimental pulse-tube vibrations of cryogen-free refrigerators. Here, we solve the pulse-tube problem using a rigidly wired metallic sample holder, which provides a microkelvin environment with low heat leaks despite the vibrations. Further, we demonstrate an improved type of temperature sensor, the gate Coulomb blockade thermometer (gCBT), employing a gate metallization covering the entire device. This immunizes against nanofabrication imperfections and uncontrollable offset charges, and extends the range to lower temperatures compared to a junction CBT with the same island capacitance, here down to $\approx$160 $\mu$K for a 10% accuracy. Using on- and off-chip cooling, we demonstrate electronic temperatures as low as 224 $\pm$ 7 $\mu$K, remaining below 300 $\mu$K for 27 hours, thus providing time for experiments. Finally, we give an outlook for cooling below 50 $\mu$K for a future generation of microkelvin transport experiments.

In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture. In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here we present a method, based on conformal mapping techniques, to predict a resonator's parameters directly from its 2D cross-section, without computationally heavy and time-consuming 3D simulation. We demonstrate the method's validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies, for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the inter-chip spacing.

On-chip demagnetization refrigeration has recently emerged as a powerful tool for reaching microkelvin electron temperatures in nanoscale structures. The relative importance of cooling on-chip and off-chip components and the thermal subsystem dynamics are yet to be analyzed. We study a Coulomb blockade thermometer with on-chip copper refrigerant both experimentally and numerically, showing that dynamics in this device are captured by a first-principles model. Our work shows how to simulate thermal dynamics in devices down to microkelvin temperatures, and outlines a recipe for a low-investment platform for quantum technologies and fundamental nanoscience in this novel temperature range.

The state-of-the-art infrared (IR) detection uses quantum photodetectors and bolometers. Quantum IR photodetectors are expensive and require cooling, and exotic and toxic materials. Whereas, bolometers are cost-efficient and uncooled, but they are much slower and less sensitive. Recently we have demonstrated that ultra-thin, highly-doped silicon membranes can be used to build fast and highly-sensitive thermoelectric bolometers. We present the fabrication of these devices, electro-thermal characterization results, and estimate the full potential of this technology.