In this paper, we introduce a compliant mechanical amplifier (mechAMP) suitable for the sensitivity enhancement in MEMS sensor applications. The design, fabrication and characterization of a planar compliant amplifier mechanism is presented with special focus on the kinematic and static system modelling of the displacement and force amplification. We show that the proposed system can also be applied as mechanical stiffness transformer for the adaption of mechanical signals or as mechanical transformer for MEMS actuators. Based on a kinematic model, a compact mechanism with a system size of 930 μm x 2080 μm and a displacement amplification ratio of 200 with an output displacement in a range of 100 μm was designed. The fabrication of the system was carried out using silicon-on-insulator (SOI) technology. Experimentally, we could verify an amplification ratio of 197.9 for the designed and fabricated system which corresponds to the analytic model by a deviation of about 1%. [2019-0228]

We present the design, fabrication, and characterization of a MEMS-based 3-bit Digital-to-Analog Converter (DAC) that allows the generation of large displacements. The DAC consists of electrostatic bending-plate actuators that are connected to a mechanical amplifier (mechAMP), enabling the amplification of the DAC output displacement. Based on a parallel binary-encoded voltage signal, the output displacement of the system can be controlled in an arbitrary order. Considering the system design, we present a simplified analytic model, which was confirmed by FE simulation results. The fabricated systems showed a total stroke of approx. 149.5 ± 0.3 µm and a linear stepwise displacement of 3 bit correlated to 2³ ≙ eight defined positions at a control voltage of 60 V. The minimum switching time between two input binary states is 0.1 ms. We present the experimental characterization of the system and the DAC and derive the influence of the mechAMP on the functionality of the DAC. Furthermore, the resonant behavior and the switching speed of the system are analyzed. By changing the electrode activation sequence, 27 defined positions are achieved upgrading the 3-bit systems into a 3-tri-state (3³) system.

In this paper we introduce the concept, modelling and analysis of triangular and sinusoidal springs intended for large in-plane translational displacements for MEMS-guiding applications. The proposed spring systems combine the advantages of minimal space requirement, low stiffness in the axial direction and high mechanical resistance in off-axis directions. An analytical model for the description of the force-displacement characteristic of triangular springs is derived considering typical mechanical constraints. Based on the model, geometrical parameters of the springs influencing linearity and selectivity with respect to the in- and off-axis stiffness are analyzed. The validity of the models is demonstrated by finite element analysis and experimental verification realized by silicon-on-insulator demonstrators. [2020-0360]

We present a micro-electromechanical reflectarray driven by large displacement actuators with multi-point stability that is intended for THz beam steering. The reflectarray consists of a stack of multiple SOI-chips each featuring a movable reflector. The position of each reflector is individually varied by in-plane mechanical digital-to-analog converters (DAC) that address 27 discrete and equidistant positions driven by only three pairs of cascaded tri-stable electrostatic actuators. Generally, the mechanical DAC addresses 3 $^n$ equidistant positions at a minimum number of 2 $n$ actuators. The reflector displacement is enlarged by combining the DAC output with a mechanical leverage. We demonstrate an SOI-fabrication method allowing to stack multiple chips for a one-dimensional array featuring large displacement DACs and large reflector surfaces. The full-wave electromagnetic simulations of the reflectarray verify its feasibility for terahertz beam steering applications. The electro-mechanical characterization shows the high-resolution displacement of single actuation systems as well as the functionality of a stacked 3 $\times$ 1 reflectarray. 2022-0149

This paper describes a concept for a passive microfluidic time-temperature indicator (TTI) intended for intelligent food packaging. A microfluidic system is presented that makes use of the temperature-dependent flow of suitable food ingredients in a microcapillary. Based on the creeping distance inside the capillary, the time-temperature integral can be determined. A demonstrator of the microsystem has been designed, fabricated and characterised using liquid sugar alcohols as indicator fluids. To enable a first wireless read-out of the passive TTI, the sensor was read out using a commercial RFID equipment, and capacitive measurements have been carried out.

In this paper, an electrostatic compliant mechanical amplifier intended for force-compensated displacement amplification in MEMS sensor applications is described. Usually, mechanical transformers that enhance a small input displacement into a large output displacement generate large forces at the input of the transformer. The microsystem proposed here allows for the reduction and compensation of the input stiffness of the amplifier and any mechanical components connected to it while providing a constant amplification ratio at the same time. The amplifying mechanism features bidirectional electrostatic anti-springs enabling the control of the stiffness by applying a constant DC voltage. The electrode design of the anti-springs and its influence on the force-displacement characteristic, the side instability and the maximal displacement are studied through analytical approaches and supported by FEA and by experiments. Based on the derived models, a compliant electromechanical amplifier is developed, featuring an amplification ratio of 50. For this amplifier the initial input stiffness of 422 N/m could be reduced to 6.8 N/m by applying a voltage of 100 V. As an additional application, we show how the amplifier can be used as a mechanical force sensor with tuneable sensitivity, where the forces at the input are transformed into large output displacements. Through experiments, we show how the sensitivity can be adjusted and increased by a factor of 25 by applying a voltage at the anti-springs.