I am a Ph.D. researcher in Materials Science and Engineering at Clarkson University, specializing in semiconductor processing, chemical mechanical planarization (CMP), and advanced semiconductor packaging. My research focuses on slurry chemistry, copper planarization, through-glass via (TGV) technology, and post-CMP cleaning to improve surface quality and process reliability. I have hands-on experience in electrochemical characterization, atomic force microscopy (AFM), and scanning electron microscopy (SEM). My research interests include surface and interface engineering, nanomaterials, and developing sustainable solutions for next-generation semiconductor technologies.