Al/Cu bimetal was processed via a novel compound casting method in this paper. Interface characteristics of the Al/Cu bimetal were studied, and the generation mechanism of the interface was also discussed. The interface of the Al/Cu bimetal displayed a defect-free and uniform morphology, which was constituted by α(Al)+Al₂Cu eutectic, Al₂Cu, AlCu, Al₄Cu₉, and Si phases. The preferred crystallographic orientations of the α(Al) and Si phase growths were respectively {111} and {001}, while the textures of the Al₂Cu, AlCu, Al₄Cu₉ phases were basically random. A bonding mechanism of the fusion and diffusion was proposed for interface formation of the Al/Cu bimetal. The interface had much higher hardness in comparison with the Al and Cu substrates, and the Al₄Cu₉ phase in the interface layer obtained the highest hardness, up to 9.6 GPa. The bonding strength of the Al/Cu bimetal achieved approximately 28.5 MPa. The fractographs from the fractured surface of the Al/Cu bimetal represented a brittle fracture characteristic, and the fracture mainly initiated from the α(Al)+Al₂Cu eutectic.