Ricardo Carmona-Galan

Dr. Ricardo Carmona-Galan

CSIC
orcid

Research Focus & Metrics

Academic Career Length

33Years (1994-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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10 May 2004 in IEEE Transactions on Circuits and Systems I: Regular Papers
Verified
Journal Article
Closed access
Ángel Rodríguez-VázquezÁngel Rodríguez-Vázquez
Ángel Rodríguez-Vázquez
GLG. Linan
G. Linan
LCL. Carranza
L. Carranza
ERE. Roca-Moreno
E. Roca-Moreno
Ricardo Carmona-GalanRicardo Carmona-Galan
Ricardo Carmona-Galan
SES. EspejoMeana
S. EspejoMeana
Today, with 0.18-/spl mu/m technologies mature and stable enough for mixed-signal design with a large variety of CMOS compatible optical sensors available and with 0.09-/spl mu/m technologies knocking at the door of designers, we can face the design of integrated systems, instead of just integrated circuits. In fact, significant progress has been made in the last few years toward the realization of vision systems on chips (VSoCs). Such VSoCs are eventually targeted to integrate within a semiconductor substrate the functions of optical sensing, image processing in space and time, high-level processing, and the control of actuators. The consecutive generations of ACE chips define a roadmap toward flexible VSoCs. These chips consist of arrays of mixed-signal processing elements (PEs) which operate in accordance with single instruction multiple data (SIMD) computing architectures and exhibit the functional features of CNN Universal Machines. They have been conceived to cover the early stages of the visual processing path in a fully-parallel manner, and hence more efficiently than DSP-based systems. Across the different generations, different improvements and modifications have been made looking to converge with the newest discoveries of neurobiologists regarding the behavior of natural retinas. This paper presents considerations pertaining to the design of a member of the third generation of ACE chips, namely to the so-called ACE16k chip. This chip, designed in a 0.35-/spl mu/m standard CMOS technology, contains about 3.75 million transistors and exhibits peak computing figures of 330 GOPS, 3.6 GOPS/mm/sup 2/ and 82.5 GOPS/W. Each PE in the array contains a reconfigurable computing kernel capable of calculating linear convolutions on 3/spl times/3 neighborhoods in less than 1.5 /spl mu/s, imagewise Boolean combinations in less than 200 ns, imagewise arithmetic operations in about 5 /spl mu/s, and CNN-like temporal evolutions with a time constant of about 0.5 /spl mu/s. Unfortunately, the many ideas underlying the design of this chip cannot be covered in a single paper; hence, this paper is focused on, first, placing the ACE16k in the ACE chip roadmap and, then, discussing the most significant modifications of ACE16K versus its predecessors in the family.

1 July 1997 in IEEE Journal of Solid-State Circuits
Verified
Journal Article
Closed access
RDR. Dominguez-Castro
R. Dominguez-Castro
SES. Espejo
S. Espejo
Ángel Rodríguez-VázquezÁngel Rodríguez-Vázquez
Ángel Rodríguez-Vázquez
Ricardo Carmona-GalanRicardo Carmona-Galan
Ricardo Carmona-Galan
PFP. Foldesy
P. Foldesy
TRT. Roska
T. Roska

1 May 1996 in International Journal of Circuit Theory and Applications
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Journal Article
Closed access
PDF file
SES. Espejo
S. Espejo
Ricardo Carmona-GalanRicardo Carmona-Galan
Ricardo Carmona-Galan
RDR. Domínguez-Castro
R. Domínguez-Castro
Ángel Rodríguez-VázquezÁngel Rodríguez-Vázquez
Ángel Rodríguez-Vázquez

28 June 2004 in IEEE Journal of Solid-State Circuits
Verified
Journal Article
Open access
GCG.L. Cembrano
G.L. Cembrano
Ángel Rodríguez-VázquezÁngel Rodríguez-Vázquez
Ángel Rodríguez-Vázquez
Ricardo Carmona-GalanRicardo Carmona-Galan
Ricardo Carmona-Galan
FJF. Jimenez-Garrido
F. Jimenez-Garrido
SES. Espejo
S. Espejo
RDR. Dominguez-Castro
R. Dominguez-Castro
This paper presents a mixed-signal programmable chip for high-speed vision applications. It consists of an array of processing elements, arranged to operate in accordance with the principles of single instruction multiple data (SIMD) computing architectures. This chip, implemented in a 0.35-/spl mu/m fully digital CMOS technology, contains /spl sim/ 3.75 M transistors and exhibits peak performance figures of 330 GOPS (8-bit equivalent giga-operations per second), 3.6 GOPS/mm/sup 2/ and 82.5 GOPS/W. It includes structures for image acquisition and for image processing, meaning that it does not require a separate imager for operation. At the sensory side, integration and log-compression sensing circuits are embedded, thus allowing the chip to handle a large variety of illumination conditions. At the processing plane, analog and digital circuits are employed whose parameters can be programmed and their architecture reconfigured for the realization of software-coded processing algorithms. The chip provides, and accepts, 8-bit digitized data through a 32-bit bidirectional data bus which operates at 120 MB/s. Experimental results show that frame rates of 1000 frames per second (FPS) can be achieved under room illumination conditions; applications using exposures of about 50 /spl mu/s have been recently reached by using special illumination setups. The chip can capture an image, run approximately 150 two-dimensional linear convolutions, and download the result in 8-bit digital format, in less than 1 ms. This feature, together with the possibility of executing sequences of user-definable instructions (stored on a full-custom 32-kb on-chip memory), and storing intermediate results (up to 8 grayscale images) makes the chip a true general-purpose sensory/processing device.

16 June 2017 in IEEE Transactions on Circuits and Systems I: Regular Papers
Verified
Journal Article
Open access
IVIon Vornicu
Ion Vornicu
Ricardo Carmona-GalanRicardo Carmona-Galan
Ricardo Carmona-Galan
ARAngel Rodriguez-Vazquez
Angel Rodriguez-Vazquez
Direct time-of-flight (d-ToF) estimation with high frame rate requires the incorporation of a time-to-digital converter (TDC) at pixel level. A feasible approach to a compact implementation of the TDC is to use the multiple phases of a voltage-controlled ring-oscillator (VCRO) for the finest bits. The VCRO becomes central in determining the performance parameters of a d-ToF image sensor. In this paper, we are covering the modeling, design, and measurement of a CMOS pseudo-differential VCRO. The oscillation frequency, the jitter due to mismatches and noise and the power consumption are analytically evaluated. This design has been incorporated into a 64×64-pixel array. It has been fabricated in a 0.18 μm standard CMOS technology. Occupation area is 28×29 μm 2 and power consumption is 1.17 mW at 850 MHz. The measured gain of the VCRO is of 477 MHz/V with a frequency tuning range of 53%. Moreover, it features a linearity of 99.4% over a wide range of control frequencies, namely, from 400 to 850 MHz. The phase noise is of -102 dBc/Hz at 2 MHz offset frequency from 850 MHz. The influence of these parameters in the performance of the TDC has been measured. The minimum time bin of the TDC is 147 ps with a rms DNL/ INL of 0.13/ 1.7LSB.

8 September 2024 in Ecological Informatics
Verified
Journal Article
Open access
DVDelia Velasco-Montero
Delia Velasco-Montero
JFJorge Fernández-Berni
Jorge Fernández-Berni
Ricardo Carmona-GalanRicardo Carmona-Galan
Ricardo Carmona-Galan
ASAriadna Sanglas
Ariadna Sanglas
FPFrancisco Palomares
Francisco Palomares