Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Two different azosulphonate dyes were synthesised and purified for the preparation of a water-based photoreactive azosulphonate-doped poly(vinyl alcohol). The aim was the investigation of a novel azosulphonate-poly(vinyl alcohol) photoresist with decreased water solubility after illumination, setting a focus on environmentally benign substances. The electron distribution of the aromatic rings of the two different azosulphonate molecules were changed by the UV-induced cleavage of the –N=N–SO₃⁻ groups, which was evidenced by UV spectroscopy. The formation of ester groups was detected by Fourier-transform infrared and ¹³C nuclear magnetic resonance spectroscopy. UV–Vis spectroscopy was used to investigate the photoreactivity of the prepared films. Photolithographic experiments demonstrated the applicability of these newly produced materials as photoresist materials. In addition, these materials provide high thermal stability.