Purpose: The purpose of this paper was to develop the methodology of thick-film/low temperature co-fired ceramic (LTCC) multilayer thermoelectric microgenerator fabrication including the procedure of silver-nickel thermocouples integration with LTCC. Design/methodology/approach: To miniaturize the structures and to increase the output parameters (generated voltage, electrical power), the microgenerator was designed as multilayer systems. It allows to reduce size of the system and to increase the number of thermocouples integrated inside the structure. It also protects buried thermocouples against exposure to harmful external factors (e.g. moisture, oxidation and mechanical exposures). As a substrate, LTCC was used. For the thermocouples fabrication, thick-film pastes based on silver and nickel were chosen. Ag/Ni thermocouple has nearly three times higher Seebeck coefficient and 30 per cent lower electrical resistance than the combination of Ag/PdAg used in previous works of the author. Findings: A multi-layer thick-film thermoelectric generator based on LTCC and Ag, Ni pastes was fabricated. Thirty Ag/Ni thermocouples were precisely screen-printed on few layers. Thermocouples’ arms are 15 mm long and about 150 μm wide. Interlayer connections (via-holes filled with conductive paste) provided the electrical contact between the layers. The biggest fabricated harvester consisted of 90 miniature thermocouples buried inside the LTCC. Originality/value: The paper presents the results of research that provided to optimize the co-firing process of the LTCC/Ni set. In the result, the methodology of co-firing of silver-nickel thermocouples and LTCC ceramic was elaborated. Also, the methodology of fabrication of miniature thermoelectric energy harvesters was optimized.

The purpose of this paper is to analyze the magnetic field distribution over a disc with magnets. This disk is part of an electromagnetic microgenerator that allows the generation of electricity as a result of changes in the magnetic field. The other part of the microgenerator is the structure of the coils. In the previous work of the authors, a complete microgenerator system was presented where the coils were made using thick-film and low-temperature co-fired ceramic (LTCC) technology. Several studies related to the influence of the shape and number of coils on the generated power were carried out, as well as the realization of complete electromagnetic microgenerators with voltage rectifying circuits. Until now, a disc with 28 neodymium magnets of size 10 × 3 × 1.5 mm³ was used for testing. In order to optimize the structure of the microgenerator with respect to the disc with magnets and thus increase the generated power, it was decided to perform appropriate tests to analyze the magnetic field distribution for several configurations of the disc varying in the shape and the dimensions of the magnets. Simulations were performed in COMSOL Multiphysics using the finite element method.

This paper has three main purposes. The first is to investigate whether it is appropriate to use a planar thick-film thermoelectric sensor to monitor the temperature difference in a processor heat sink. The second is to compare the efficiency of two heat sink models. The third is to compare two kinds of sensors, differing in length. The model of the CPU heat sink sensor system was designed for numerical simulations. The relations between the CPU, heat sink, and the thermoelectric sensor were modelled because they are important for increasing the efficiency of fast processors without interfering with their internal structure. The heat sink was mounted on the top of the thermal model of a CPU (9.6 W). The plate fin and pin fin heat sinks were investigated. Two planar thermoelectric sensors were mounted parallel to the heat sink fins. These sensors monitored changes in the temperature difference between the CPU and the upper surface of the heat sink. The system was equipped with a cooling fan. Switching on the fan changed the thermal conditions (free or forced convection). The simulation results showed the temperature gradient appearing along the sensor for different heat sinks and under different thermal conditions. Comparison of the results obtained in the simulations of the CPU heat sink sensor systems proves that changes in the cooling conditions can cause a strong, step change in the response of the thermoelectric sensor. The results suggest that usage of the pin fin heat sink model is a better solution for free convection conditions. In the case of strong forced convection the heat sink type ceases to be significant.

The monitoring of processor temperature is crucial to increase its efficiency. One of the novel approaches is use the information not only about the CPU (Central Processing Unit) thermal state, but also about changing environmental conditions. The additional temperature difference sensor to monitor thermal changes in the processor environment is necessary. The sensor dedicated for active heat sink, often used inside laptops, was designed, fabricated and investigated. To fulfill the requirements and to match to the specific shape of the active heat sink, the hybrid sensor was proposed. It was composed of six thermocouples and fabricated using thick-film and LTCC (Low Temperature Cofired Ceramic) technology combined with wire thermocouples. Thick-film/LTCC flat substrates with thermoelectric paths ensured good thermal contact between the sensor and the monitored surface. The thermoelectric wires allowed adjusting the sensor to the complicated shape of the active heatsink. Three different versions of the sensor were realized and compared. All of them seem to be suitable for measuring the temperature difference in the given application and they can be used in further works.

This paper presents thermoelectric properties of thick-film composites in relation to their potential use as power microgenerators. Several different combinations of composites were used to create thermopiles. One track of each thermocouple was made of PdAg or Pt and was the reference track and the second one of the tested material. After preliminary tests five composites with low resistance and adequate Seebeck coefficient were chosen (Ag, Ag+RuO2 and three kinds of RuO2). We measured the Thermoelectric Force, ET = f(T) and internal resistance Ri = f(T) characteristics over the temperature range 293 to 493 K. PdAg/Ag thermocouples have nearly two orders of magnitude higher output electrical power than the others. The change in values of electrical parameters of thermopiles after long-term ageing processes was also investigated.

Properties of Ag-based glass-less photoimageable paste designed for unfired LTCC were investigated. The paste isn't designed for patterns performing on the external surface of the substrate. Because it doesn't contains glass layer to substrate adhesion after the firing process is very weak. Also between individual grains of the silver there is no glass what could resulting in increased contact area of adjacent grains. It may improve the paste sintering. As a result lower electrical resistivity of the layer can be achieved. But also mechanical strength of the layer is reduced. In practice, the paste is not suitable for patterns fabrication on the external surface of the substrate - it detaches from it. The ink is designed for performing the buried layers inside LTCC ceramics. Investigations showed good compatibility of the paste and the DP951 and DP9K7 green tapes (DuPont). The tests showed designed pattern was precisely imaged on the substrate. Details had sharp, perpendicular edges what is characteristic for the photoimageable inks technique.