A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

The design, fabrication, and testing of a resonant cantilever beam in complementary metal-oxide semiconductor (CMOS) technology is presented in this paper. The resonant cantilever beam is a gas-sensing device capable of monitoring hazardous vapors and gases at trace concentrations. The new design of the cantilever beam described here includes interdigitated fingers for electrostatic actuation and a piezoresistive Wheatstone bridge design to read out the deflection signal. The reference resistors of the Wheatstone bridge are fabricated on auxiliary beams that are immediately adjacent to the actuated device. The whole device is fabricated using a 0.6-/spl mu/m, three-metal, double-poly CMOS process, combined with subsequent micromachining steps. A custom polymer layer is applied to the surface of the microcantilever beam to enhance its sorptivity to a chemical nerve agent. Exposing the sensor with the nerve agent simulant dimethylmethylphosphonate (DMMP), provided a demonstrated detection at a concentration of 20 ppb or 0.1 mg/m/sup 3/. These initial promising results were attained with a relatively simple design, fabricated in standard CMOS, which could offer an inexpensive option for mass production of a miniature chemical detector, which contains on chip electronics integrated to the cantilever beam.

This work describes an implementation of a thermoelectric microwave power sensor fabricated through commercial CMOS process with additional maskless etching. The sensor combines micromachined coplanar waveguide and contact pads, a microwave termination which dissipates heat proportionally to input microwave power, and many aluminum-polysilicon thermocouples. The device was designed and fabricated in standard CMOS technology, including the appropriate superimposed dielectric openings for post-fabrication micromachining. By removing the bulk silicon located beneath the device through micromachining, thermal and electromagnetic losses are minimized. The sensor measures signal true RMS power in the frequency range up to 20 GHz with input power in the -30 dBm to +10 dBm range. Over this 40 dB dynamic range, output voltage versus input power is linear within less than /spl plusmn/0.16%. Automatic network analyzer data show an acceptable input return loss of less than -30 dB over the entire frequency range.