Controlled fabrication of 45 nm width nanowire using simulated emission depletion (STED) direct laser writing with a rod-shape effective focus spot is presented. In conventional STED direct laser writing, normally a donut-shaped depletion focus is used, and the minimum linewidth is restricted to 55 nm. In this work, we push this limit to sub-50 nm dimension with a rod-shape effective focus spot, which is the combination of a Gaussian excitation focus and twin-oval depletion focus. Effects of photoinitiator type, excitation laser power, and depletion laser power on the width of the nanowire are explored, respectively. Single nanowire with 45 nm width is obtained, which is λ/18 of excitation wavelength and the minimum linewidth in pentaerythritol triacrylate (PETA) photoresist. Our result accelerates the progress of achievable linewidth reduction in STED direct laser writing.

This paper develops an array micro-grooves manufacturing method using micro electrochemical machining (ECM) with disk electrode, which is prepared by in-situ micro wire electrical discharge machining (WEDM). This technology focuses on the difficulty of array structure manufacture in micro-electro-mechanical systems (MEMS). A micro-ECM system is built based on the micro-WEDM machine to achieve high precision processing of the array micro-grooves. Since micro-WEDM has good performance in high precision machining of the rotating structure, single and multi-edge disk electrodes can be fabricated in-situ using graphite. The as-prepared disk tool electrode is directly used for micro-electrochemical milling of the array micro-grooves without disassembling away from the device, which avoids the positioning error caused by the re-clamping of the disk electrode. With the advantages of high surface quality and no electrode loss, micro-ECM improves the manufacture performance of the micro-parts. Through wire path optimization, the shape accuracy of the disk edge is improved. After the research of the micro-ECM parameters, the process is improved, and finally, the high precision array micro-grooves are obtained. This method combines the advantages of micro-WEDM and disk electrode micro-ECM milling, and it is convenient for large-scale manufacture of array micro-structures on micro-parts and MEMS.

Combining developments in high-power (/spl sim/100 W) laser diode arrays and high heat flux (kW/cm/sup 2/) water-cooled Cu-'mini-channel' heatsinks, we demonstrate record average power density operation of diode laser stacks. Using advanced die attachment, record CW power levels of 180 W and 108 W has been demonstrated at 915 nm & 808 nm, respectively, from 1 cm wide laser arrays on such heatsinks.