fuliang Wang

Prof. Dr. fuliang Wang

orcid

Research Focus & Metrics

Academic Career Length

22Years (2005-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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1 February 2017 in Microelectronic Engineering
Verified
Journal Article
Closed access
HXHongbin Xiao
Hongbin Xiao
HHHu He
Hu He
XRXinyu Ren
Xinyu Ren
PZPeng Zeng
Peng Zeng
FWfuliang Wang
fuliang Wang

25 May 2016 in Journal of Central South University
Verified
Journal Article
Closed access
PDF file
FWfuliang Wang
fuliang Wang
BZBo Zuo
Bo Zuo

30 October 2023 in Electrochimica Acta
Verified
Journal Article
Closed access
NNNantian Nie
Nantian Nie
FWfuliang Wang
fuliang Wang
WYWenhao Yao
Wenhao Yao

1 July 2019 in Microelectronic Engineering
Verified
Journal Article
Closed access
FWfuliang Wang
fuliang Wang
KZKang Zhou
Kang Zhou
QZQinglong Zhang
Qinglong Zhang
YLYuping Le
Yuping Le
WLWei Liu
Wei Liu
FWFeng Wang
Feng Wang

16 April 2019 in Nanomaterials
Verified
Journal Article
Open access
PDF file
ZQzhenkun Qi
zhenkun Qi
HBHailiang Bian
Hailiang Bian
YYYi Yang
Yi Yang
NNNantian Nie
Nantian Nie
FWfuliang Wang
fuliang Wang
Highly stretchable, flexible, and sensitive strain sensors have promising applications in motion detection—especially multifunctional strain sensors that can detect stretching, bending, compression and twisting. Herein, this study presents a graphene and glycerol solution-based multifunctional sensor with ultra-high stretchability and sensitivity. Owing to the self-lubrication and fluidity of the graphene-glycerol solution, the strain sensors display super stretchability up to 1000%, a maximum gauge factor up to 45.13, and excellent durability for over 10,000 cycles. In addition, the sensor can also rapidly respond to small strains (1%, 5%, 10%) and different stretching rates (12.5%/s, 25%/s, 50%/s, and 100%/s). More impressively, the sensors can measure up to 50 kPa pressure and 180° twisting without any damage. Furthermore, the strain sensors demonstrate their applicability in scenarios involving motion detection, such as that for finger bending, wrist rotating, touching, and drinking water.

6 August 2018 in Journal of Electronic Packaging
Verified
Journal Article
Closed access
PDF file
BWBo Wu
Bo Wu
SZShuanghai Zhang
Shuanghai Zhang
FWfuliang Wang
fuliang Wang
ZCZhuo Chen
Zhuo Chen
The incorporation of a micro copper pillar is considered as the major interconnection method in three-dimensional (3D) integrated circuit (IC) intergradation under high-density I/O conditions. To achieve low-temperature bonding, this study investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μm pillar bump, and substrate temperature of 200 °C. Additionally, the effect of the bonding force on bonding interface microstructure and intermetallic compounds (IMCs) was also investigated. Tin whiskers were also observed at the bonding interface at low bonding forces.