Dries Vaes

Mr. Dries Vaes

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Research Focus & Metrics

Academic Career Length

8Years (2019-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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30 June 2019 in Applied Sciences
Verified
Journal Article
Open access
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DVDries Vaes
Dries Vaes
MCMargot Coppens
Margot Coppens
BGBart Goderis
Bart Goderis
WZWim Zoetelief
Wim Zoetelief
PPPeter Van Puyvelde
Peter Van Puyvelde
Although semi-crystalline polymers are associated with considerably better mechanical properties and thermal stability compared to their amorphous counterparts, using them as feedstock for Fused Filament Fabrication still poses some major challenges. Hence, the development of printed part crystallinity during printing should be fully understood in order to control the developed weld strength, as well as part shrinkage and warpage. Infrared thermography was utilized to record the thermal history of deposited layers while printing a single-layer wall geometry, employing two PA 6/66 copolymers with distinct molecular weights as feedstock. Print settings were varied to establish which settings are essential to effectively monitor final part crystallinity. The resulting temperature profiles were simulated in a Fast Scanning Chip Calorimetry device that allows for the rapid heating and cooling rates experienced by the printed polymer. Both liquefier temperature and print speed were found to have very little influence on the total attained crystallinity. It became apparent that the build plate, set at a temperature above the polymer’s glass transition temperature, imposes a considerable annealing effect on the printed part. A reduced molecular weight was observed to enhance crystallinity even more strongly. The presented methodology proves that Fast Scanning Chip Calorimetry is an effective tool to assess the impact of both print parameters and feedstock characteristics on the crystallization behavior of semi-crystalline polymers over the course of printing.

11 August 2021 in Polymers
Verified
Journal Article
Open access
PDF file
DVDries Vaes
Dries Vaes
MCMargot Coppens
Margot Coppens
BGBart Goderis
Bart Goderis
WZWim Zoetelief
Wim Zoetelief
PPPeter Van Puyvelde
Peter Van Puyvelde
One of the main drawbacks of Fused Filament Fabrication is the often-inadequate mechanical performance of printed parts due to a lack of sufficient interlayer bonding between successively deposited layers. The phenomenon of interlayer bonding becomes especially complex for semi-crystalline polymers, as, besides the extremely non-isothermal temperature history experienced by the extruded layers, the ongoing crystallization process will greatly complicate its analysis. This work attempts to elucidate a possible relation between the degree of crystallinity attained during printing by mimicking the experienced thermal history with Fast Scanning Chip Calorimetry, the extent of interlayer bonding by performing trouser tear fracture tests on printed specimens, and the resulting crystalline morphology at the weld interface through visualization with polarized light microscopy. Different printing conditions are defined, which all vary in terms of processing parameters or feedstock molecular weight. The concept of an equivalent isothermal weld time is utilized to validate whether an amorphous healing theory is capable of explaining the observed trends in weld strength. Interlayer bond strength was found to be positively impacted by an increased liquefier temperature and reduced feedstock molecular weight as predicted by the weld time. An increase in liquefier temperature of 40 °C brings about a tear energy value that is three to four times higher. The print speed was found to have a negligible effect. An elevated build plate temperature will lead to an increased degree of crystallinity, generally resulting in about a 1.5 times larger crystalline fraction compared to when printing occurs at a lower build plate temperature, as well as larger spherulites attained during printing, as it allows crystallization to occur at higher temperatures. Due to slower crystal growth, a lower tie chain density in the amorphous interlamellar regions is believed to be created, which will negatively impact interlayer bond strength.