This paper reports a large-range electrothermal bimorph microelectromechanical systems (MEMS) mirror with fast thermal response. The actuator of the MEMS mirror is made of three segments of Cu/W bimorphs for lateral shift cancelation and two segments of multimorph beams for obtaining large vertical displacement from the angular motion of the bimorphs. The W layer is also used as the embedded heater. The silicon underneath the entire actuator is completely removed using a unique backside deep-reactive-ion-etching DRIE release process, leading to improved thermal response speed and front-side mirror surface protection. This MEMS mirror can perform both piston and tip-tilt motion. The mirror generates large pure vertical displacement up to 320 μm at only 3 V with a power consumption of 56 mW for each actuator. The maximum optical scan angle achieved is ±18° at 3 V. The measured thermal response time is 15.4 ms and the mechanical resonances of piston and tip-tilt modes are 550 Hz and 832 Hz, respectively.

This paper presents the design, fabrication, and characterization of an electrothermal MEMS mirror with large tip, tilt and piston scan. This MEMS mirror is based on electrothermal bimorph actuation with Cu and W thin-film layers forming the bimorphs. The MEMS mirror is fabricated via a combination of surface and bulk micromachining. The piston displacement and tip-tilt optical angle of the mirror plate of the fabricated MEMS mirror are around 114 μm and ±8°, respectively at only 2.35 V. The measured response time is 7.3 ms. The piston and tip-tilt resonant frequencies are measured to be 1.5 kHz and 2.7 kHz, respectively. The MEMS mirror survived 220 billion scanning cycles with little change of its scanning characteristics, indicating that the MEMS mirror is stable and reliable.

Scanning micromirrors have been used in a wide range of areas, but many of them do not have position sensing built in, which significantly limits their application space. This paper reports an integrated optoelectronic position sensor (iOE-PS) that can measure the linear displacement and tilting angle of electrothermal MEMS (Micro-electromechanical Systems) scanning mirrors. The iOE-PS integrates a laser diode and its driving circuits, a quadrant photo-detector (QPD) and its readout circuits, and a band-gap reference all on a single chip, and it has been fabricated in a standard 0.5 μm CMOS (Complementary Metal Oxide Semiconductor) process. The footprint of the iOE-PS chip is 5 mm × 5 mm. Each quadrant of the QPD has a photosensitive area of 500 µm × 500 µm and the spacing between adjacent quadrants is 500 μm. The iOE-PS chip is simply packaged underneath of an electrothermally-actuated MEMS mirror. Experimental results show that the iOE-PS has a linear response when the MEMS mirror plate moves vertically between 2.0 mm and 3.0 mm over the iOE-PS chip or scans from −5 to +5°. Such MEMS scanning mirrors integrated with the iOE-PS can greatly reduce the complexity and cost of the MEMS mirrors-enabled modules and systems.

Over the last decade, two-photon microscopy (TPM) has been the technique of choice for in vivo noninvasive optical brain imaging for neuroscientific study or intra-vital microendoscopic imaging for clinical diagnosis or surgical guidance because of its intrinsic capability of optical sectioning for imaging deeply below the tissue surface with sub-cellular resolution. However, most of these research activities and clinical applications are constrained by the bulky size of traditional TMP systems. An attractive solution is to develop miniaturized TPMs, but this is challenged by the difficulty of the integration of dynamically scanning optical and mechanical components into a small space. Fortunately, microelectromechanical systems (MEMS) technology, together with other emerging micro-optics techniques, has offered promising opportunities in enabling miniaturized TPMs. In this paper, the latest advancements in both lateral scan and axial scan techniques and the progress of miniaturized TPM imaging will be reviewed in detail. Miniature TPM probes with lateral 2D scanning mechanisms, including electrostatic, electromagnetic, and electrothermal actuation, are reviewed. Miniature TPM probes with axial scanning mechanisms, such as MEMS microlenses, remote-focus, liquid lenses, and deformable MEMS mirrors, are also reviewed.