The goal of this study is to employ bio-based dialdehyde starch (DAS), derived from in situ polymerization and the resultant microphase separation structure, to improve the strength of melamine–urea–formaldehyde (MUF) resin, as well as enhance the properties that affect its adhesive performance. Thus, we evaluated the effects of DAS on the chemical structure, toughness, curing behavior, thermal stability, and micromorphology of the MUF resin. Furthermore, the wet shear strength and formaldehyde emissions of a manufactured, three-layer plywood were also measured. Results indicate that DAS was chemically introduced into the MUF resin by in situ polymerization between the aldehyde group in the DAS and the amino group and hydroxymethyl group in the resin. Essentially, polymerization caused a DAS soft segment to interpenetrate into the rigid MUF resin cross-linked network, and subsequently form a microphase separation structure. By incorporating 3% DAS into the MUF resin, the elongation at break of impregnated paper increased 48.12%, and the wet shear strength of the plywood increased 23.08%. These improvements were possibly due to one or a combination of the following: (1) DAS polymerization increasing the cross-linking density of the cured system; (2) DAS modification accelerating the curing of the MUF resin; and/or (3) the microphase separation structure, induced by DAS polymerization, improving the cured resin’s strength. All the results in this study suggest that the bio-based derivative from in situ polymerization and microphase separation can effectively toughen and enhance the properties that affect adhesive performance in highly cross-linked thermosetting resins.

Chemical modification of soy protein, via crosslinking, is the preferred method for creating non-toxic, renewable, environmentally friendly wood adhesives. The denaturing process of protein is important for the adhesive performance improvement. In order to investigate the effect of different denaturing agents on the performance of soy protein-based adhesives before and after crosslinking modification. In this study, three different denaturing agents—urea (U), sodium dodecyl sulfate (SDS), and sodium hydrogen sulfite (SHS) and an epoxide crosslinking agent—Triglycidylamine (CA) were used to prepare soy protein-based adhesives. The results showed: (1) The denaturing agent unfolded protein molecules and exposed more hydrophobic groups to prevent water intrusion, which was mainly a contribution for the water resistance and performance improvement of soy protein-based adhesives. The wet shear strength was improved up to 91.3% (denaturing by urea). (2) After modifying by the crosslinking agent, the properties and performance improvement was due to the fact that the active groups on soybean protein molecules reacted with the crosslinking agent to form a crosslinking structure, and there is no obvious correlation with the hydrophobic groups of the protein. (3) The unfolded soybean protein molecules also expose hydrophilic groups, which facilitates the reaction between the crosslinking agent and protein to form a denser crosslinking structure to improve the performance of the adhesive. Particularly, after denaturing with SHS, the wet shear strength of the plywood bonded by the SPI-SHS-CA adhesive increased by 217.24%.

Traditional formaldehyde-based adhesives rely excessively on petrochemical resources, release toxic gases, and pollute the environment. Plant-derived soybean protein adhesives are eco-friendly materials that have the potential to replace the formaldehyde-based adhesives used to fabricate wood-based panels. However, the poor water resistance, high brittleness, and poor mildew resistance of soybean protein adhesives limit their industrial applications. This article reviews recent research progress in the modification of soybean protein adhesives for improving the bonding performance of adhesives used for wood-based panel fabrication. Modification methods were summarized in terms of water resistance, solid content, and mildew resistance. The modification mechanisms and remaining problems were also discussed. Finally, the current industrial applications and the future research direction of soybean protein adhesives are discussed.

In this study, polyols recycled from decomposed polyurethane (PU) foam wastes were used in preparing adhesives for plywood manufacturing. A polyol was made from chemically decomposed flexible PU foam wastes separated from automobile shredder residue. The recycled polyol was mixed with a commercial polyol at weight ratios of 100/0, 25/75, 50/50, 25/75, and 0/100, respectively. These polyol mixtures were mixed, respectively, with polymeric methylene diphenyl diisocyanate at isocyanate group–to–hydroxyl group (NCO/OH) molar ratios of 1.0, 1.25, and 1.5 to prepare adhesives. The recycled polyol and adhesives were characterized by Fourier transform infrared spectroscopy. Plywood specimens bonded by the adhesives were fabricated and tested. The effects of NCO/OH molar ratio and recycled polyol–to–commercial polyol weight ratio on adhesive gel time and bonding strength before and after water treatments were evaluated. The adhesives prepared from recycled polyol presented shorter gel time and greater dry bonding strength than those prepared from commercial polyol. The adhesives prepared from the recycled polyol–commercial polyol weight ratio of 50/50 and NCO/OH molar ratio of 1.25 showed the best bonding performance after cyclic boiling water treatment. Multilinear regressions showed that NCO/OH molar ratio was the main factor in developing plywood shear strength.

The objective of this study was to investigate the feasibility of using polyurethane (PU) foam waste obtained from automobile shredder residue (ASR) in plywood production. The PU foam waste from ASR was cleaned by water and acetone, ground into powder, dried, and mixed with polymeric diphenyl methane diisocyanate (pMDI) resin at various ratios (2.5%, 5%, 7.5%, and 10%, based on the weight of pMDI). The mixed adhesives were examined with Fourier-transform infrared spectroscopy (FTIR) and thermogravimetric (TG) analysis, and evaluated as plywood binders (measured in accordance with Chinese National Standard GB/T 17657-2013). The results indicated that the addition of PU powder into pMDI resin increased adhesive viscosity and efficiency, and also helped solve the problem of deficiency of pMDI on the veneer surface. FTIR results showed various reactions between pMDI and PU powder. This potential cross-linking might contribute to the cohesive strength of the cured adhesive. TG analysis results showed the possible increased thermal stability of the cured mixed adhesive at a temperature range of 150°C to 300°C. The best PU addition ratio was 7.5 percent of the pMDI weight, considering both the bond strength and production practice of plywood. Plywood testing showed that both the dry and wet bond strength reached the peak value at the optimal mixing ratio. The use of PU powder in plywood manufacturing provided a possible way of recycling PU foam waste while improving or maintaining the performance of plywood.

The feasibility of applying an innovative process to manufacture composite decking boards with quartersawn or starsawn southern pine lumber bonded with phenol resorcinol formaldehyde (PRF) and polyurethane (PU) adhesives was studied. It was feasible to make quatersawn-based composite decking panels with possible improved surface qualities. Accelerated aging tests showed that composite quartersawn decking samples were more resistant to aging than flatsawn decking samples in terms of shear strength, especially after exposure to 12 wet–dry aging cycles. Compared with the PRF adhesive, the PU adhesive resulted in greater initial dry shear strength but had lower shear strength after the accelerated aging test. Furthermore, the amount of wood failure increased for the PRF-bonded samples and decreased for the PU-bonded samples after accelerated aging tests. Compared with solid quartersawn decking boards, the quartersawn composite decking boards had the same modulus of rupture and modulus of elasticity.