Thanks to rapid technological innovation over the last decade, a wide range of wearable devices have emerged, playing an inspiring role in healthcare, diagnostics, and sports monitoring. This review summarizes recent progress in the development and application of electrochemical (EC) sweat sensors and self-powered systems for wearable applications. Presented here are the most common types of EC sweat sensors, namely potentiometric ion-selective electrodes, amperometric enzymatic and non-enzymatic sensors, as well as differential pulse voltammetric sensors. The sensing principle and novel functional nanomaterials that are used to enhance the performance of wearable sweat sensors and their applications are summarized. The recent advancement of battery-free wearable devices is presented, including self-powered biofuel cells (BFC), energy harvesting from novel materials and its strategy, are also discussed. The challenges in, and opportunities for, the development of sweat sensor-based wearable systems moving forward are reviewed, with the aim of shedding some light on future directions.

Sintered nano-copper is becoming a promising candidate as thermal interface material (TIM) for die attaching in high power electronics. It exhibits much higher thermal conductivity and operating temperature than conventional TIMs based on polymer and solder joints, and higher electromigration resistance and lower cost than sintered nano-silver TIM. However, the performance of existing sintered nano-copper is lower than expected because of high porosity resulted from poor sintering of copper particles with oxide shell. Here we demonstrate a method of improving the thermal conductivity of sintered copper by addition of graphene/Cu–Cu _x O with controllable diameter of ∼163 nm. The measured thermal conductivity of the sintered composite TIM is enhanced by up to 123.5% compared with that of sintered pure copper. It can be understood as a result of the formation of graphene heat transfer network in sintered TIM. In addition, the C–O–Cu bonds formed at the interface between graphene and copper nanoparticles are critical for improving thermal performance as well as electrical and mechanical performance of the TIM. The developed TIM can be widely used in high power electronic packaging especially for high temperature applications, including IGBT, SiC and GaN power devices.

Nanopores on 2D materials have great potential for DNA sequencing, which is attributed to their high sequencing speed and reduced cost. However, identifying DNA bases at such a high speed with nanometer precision has remained a big challenge. Here, we implemented theoretical calculations to show the translocation of single-stranded DNA (ssDNA) through solid-state nanopores on a 2D hexagonal boron nitride (h-BN) and graphene sheet. A base-specific ssDNA sequencing technique was devised, based on the individual differences in the ion current responses for the (polyA)₁₆, (polyG)₁₆, (polyC)₁₆, and (polyT)₁₆ bases of ssDNA. Our sequential procedure for sequencing is built on a comparative approach between the current signals obtained from the nanopores to achieve base-specific detection. Our results indicate that at higher voltages (1.0, 1.2, 1.4, 1.6, 1.8 and 2.0 V nm⁻¹), DNA translocation is tracked though the 1.5 and 2.0 nm nanopores, and at the 1.5 nm pore size, folded ssDNA close to the nanopore accounts for 93% and 81% of events for graphene and h-BN. Our calculations indicate charge transfer from the graphene to ssDNA, while the reverse happens in the case of the h-BN membrane. These results provide critical insights into our understanding of single molecule sequencing through solid-state nanopore research.

The sintering process of Cu nanoparticle (Cu NP)/graphene nanoplatelet (GNP) composite solder paste was thoroughly investigated in this work through molecular dynamics simulations. The tensile properties of the sintered Cu NP/GNP composite solder paste were considered by using the uniaxial quasi-static tensile simulation method. The impact of sintering temperature, strain rate, and GNP addition on the tensile properties of Cu NP/GNP sintered structures was thoroughly investigated. The lattice structure, dislocation evolution, and atomic diffusion of the molecular dynamics results were analyzed using the common neighbor analysis (CNA), dislocation extraction algorithm (DXA), and mean square displacement (MSD) methods. The results of the post-processing analysis showed that the addition of GNP and the sintering temperature have an important influence on the mechanical properties of Cu NP/GNP sintered structures. In addition, the incorporation of GNP can significantly improve the mechanical properties of sintered Cu NP/GNP composite solder paste. More specifically, the tensile strength and fracture strain of the sintered composite solder paste will be increased by increasing the tensile strain rate. The strengthening mechanism of the sintered Cu NP/GNP composite solder paste can be attributed to the dislocation strengthening mechanism. Our study provides valuable insight for the development of high-performance composite solder paste with enhanced mechanical properties.