Recently, microfluidic stretchable electronics has attracted great interest from academia since conductive liquids allow for larger cross-sections when stretched and hence low resistance at longer lengths. However, as a serial process it has suffered from low throughput, and a parallel processing technology is needed for more complex systems and production at low costs. In this work, we demonstrate such a technology to implement microfluidic electronics by stencil printing of a liquid alloy onto a semi-cured polydimethylsiloxane (PDMS) substrate, assembly of rigid active components, encapsulation by pouring uncured PDMS on-top and subsequent curing. The printing showed resolution of 200 μm and linear resistance increase of the liquid conductors when elongated up to 60%. No significant change of resistance was shown for a circuit with one LED after 1000 times of cycling between a 0% and an elongation of 60% every 2 s. A radio frequency identity (RFID) tag was demonstrated using the developed technology, showing that good performance could be maintained well into the radio frequency (RF) range.

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.

Stretchable electronics offers unsurpassed mechanical compliance on complex or soft surfaces like the human skin and organs. To fully exploit this great advantage, an autonomous system with a self-powered energy source has been sought for. Here, we present a new technology to pattern liquid alloys on soft substrates, targeting at fabrication of a hybrid-integrated power source in microfluidic stretchable electronics. By atomized spraying of a liquid alloy onto a soft surface with a tape transferred adhesive mask, a universal fabrication process is provided for high quality patterns of liquid conductors in a meter scale. With the developed multilayer fabrication technique, a microfluidic stretchable wireless power transfer device with an integrated LED was demonstrated, which could survive cycling between 0% and 25% strain over 1,000 times.

Soft robots leverage deformable bodies to achieve different types of locomotion, improve transportability, and safely navigate cluttered environments. In this context, variable-stiffness structures provide soft robots with additional properties, such as the ability to increase forces transmitted to the environment, to lock into different body configurations, and to reduce the number of actuators required for morphological change. Tensegrity structures have been recently proposed as a biologically inspired design principle for soft robots. However, the few examples of tensegrity structures with variable stiffness displayed relatively small stiffness change (i.e., by a factor of 3) or resorted to multiple and bulky actuators. In this article, we describe a novel design approach to variable-stiffness tensegrity structures (VSTSs) that relies on the use of variable-stiffness cables (VSCs). As an example, we describe the design and implementation of a three-strut tensegrity structure with VSCs made of low melting point alloys. The resulting VSTS displays unprecedented stiffness changes by a factor of 28 in compression and 13 in bending. We show the capabilities of the proposed VSTS in three validation scenarios with different tensegrity architectures: (1) a beam with tunable load-bearing capability, (2) a structure that can self-deploy and lock its shape in both deployed and undeployed states, and (3) a joint with underactuated shape deformations.