Suraj Dinkar Jadhav

Mr. Suraj Dinkar Jadhav

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Representative Publications

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1 August 2019 in Journal of Materials Processing Technology
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Journal Article
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SJS.D. Jadhav
S.D. Jadhav
SDS. Dadbakhsh
S. Dadbakhsh
LGL. Goossens
L. Goossens
JKJ-P Kruth
J-P Kruth
JHJ. Van Humbeeck
J. Van Humbeeck
KVK. Vanmeensel
K. Vanmeensel

2 August 2019 in Materials
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Journal Article
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SJSuraj Dinkar Jadhav
Suraj Dinkar Jadhav
Sasan DadbakhshSasan Dadbakhsh
Sasan Dadbakhsh
JVJozef Vleugels
Jozef Vleugels
JHJohan Hofkens
Johan Hofkens
PPPeter Van Puyvelde
Peter Van Puyvelde
KVKim Vanmeensel
Kim Vanmeensel
The addition of 0.1 wt % carbon nanoparticles significantly improved the optical absorption and flowability of gas-atomized copper powder. This facilitated selective laser melting (SLM) by reducing the required laser energy density to obtain 98% dense parts. Moreover, the carbon addition led to an in situ de-oxidation of the copper parts during the SLM process. The properties of the as-built copper parts were limited to a tensile strength of 125 MPa, a ductility of 3%, and an electrical conductivity of 22.7 × 106 S/m, despite the advantageous effect of carbon on the powder characteristics and SLM behavior. The modest mechanical properties were associated with the segregation of carbon nanoparticles and other impurities, such as phosphorus and oxygen along grain boundaries of epitaxially grown grains. Whereas, the low electrical conductivity was mainly attributed to the phosphorus impurity in solid-solution with copper.

15 July 2019 in Material Design & Processing Communication
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Journal Article
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SJSuraj Dinkar Jadhav
Suraj Dinkar Jadhav
JVJozef Vleugels
Jozef Vleugels
JKJean‐Pierre Kruth
Jean‐Pierre Kruth
JHJan Van Humbeeck
Jan Van Humbeeck
KVKim Vanmeensel
Kim Vanmeensel
Selective laser melting of pure copper is challenging because of its high optical reflectivity and thermal conductivity. Accordingly, the surface of pure copper powder was modified by oxidation to enhance the optical absorption. The powder with improved optical absorption facilitated the production of crack-free and dense copper parts at relatively lower laser energy density in both argon and nitrogen atmosphere. The microstructural analysis demonstrated the presence of stable melt tracks without obvious porosity. A very high electrical conductivity of approximately 89% of the international annealed copper standard, the hardness of approximately 93 HV, a tensile strength of approximately 270 MPa, and ductility of approximately 28% were achieved in the as-built condition.

1 October 2020 in Additive Manufacturing
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Journal Article
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SJSuraj Dinkar Jadhav
Suraj Dinkar Jadhav
PDPushkar Prakash Dhekne
Pushkar Prakash Dhekne
SDSasan Dadbakhsh
Sasan Dadbakhsh
JKJean-Pierre Kruth
Jean-Pierre Kruth
JHJan Van Humbeeck
Jan Van Humbeeck
KVKim Vanmeensel
Kim Vanmeensel

20 November 2019 in Advanced Engineering Materials
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Journal Article
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SJSuraj Dinkar Jadhav
Suraj Dinkar Jadhav
SDSasan Dadbakhsh
Sasan Dadbakhsh
RCRong Chen
Rong Chen
RSRajashekhara Shabadi
Rajashekhara Shabadi
JKJean-Pierre Kruth
Jean-Pierre Kruth
KVKim Vanmeensel
Kim Vanmeensel

1 December 2020 in Additive Manufacturing
Verified
Journal Article
Closed access
SJSuraj Dinkar Jadhav
Suraj Dinkar Jadhav
DFDongmei Fu
Dongmei Fu
MDMaxim Deprez
Maxim Deprez
KRKristof Ramharter
Kristof Ramharter
DWDenise Willems
Denise Willems
KVKim Vanmeensel
Kim Vanmeensel