A glass that won't break: Oxide glasses are important for applications ranging from smartphone screens to window panes. One familiar feature of glass is that it fractures and shatters when rapidly deformed, limiting the number of potential uses. However, Frankberg et al. found that they could deform thin films of glassy alumina (Al ₂ O ₃ ) with high strain rates at room temperature (see the Perspective by Wondraczek). This surprising observation is supported by simulations of the material that show that dense and flawless glassy alumina samples can deform this way. The discovery provides important insight into designing new glasses that might be more fracture resistant. Science , this issue p. 864 ; see also p. 804

For decades, nanoindentation has been used for measuring mechanical properties of films with the widely used assumption that if the indentation depth does not exceed 10% of the film thickness, the substrate influence is negligible. The 10% rule was originally deduced for much thicker metallic films on steel substrates and involved only the hardness measurement. Thus, the boundaries of usability for measuring thin film elastic modulus may differ. Two known material systems of Mo and MoTa thin films on Si substrates are examined with nanoindentation and numerical modeling to show the limitations in measuring elastic moduli. An assessment of the hardness and elastic modulus as a function of contact depth and accurate modeling of the film/substrate deformation confirms the 10% rule for hardness measurements. For elastic modulus, the indentation depths should be much smaller. Results provide a recommended testing protocol for accurate assessment of thin film elastic modulus using nanoindentation. Graphical abstract

New emerging technologies in the field of flexible electronic devices require that metal films adhere well and flex with polymer substrates. Common thin film materials used for these applications include copper (Cu) with an adhesion interlayer of chromium (Cr). Copper can be quite ductile and easily move with the polymer substrate. However, Cr is more brittle and fractures at lower strains than Cu. This study aims to examine the fracture and subsequent buckling and delamination of strained Cr films on polyimide (PI). In-situ scanning electron microscope (SEM) straining is used to systematically study the influence of film thickness on fracture and buckling strains. Film fracture and delamination depend on film thickness, and increases in crack and buckle density with decreasing thickness are explored by a shear lag model.

Thin metal films deposited on polymer substrates are used in flexible electronic devices such as flexible displays or printed memories. They are often fabricated as complicated multilayer structures. Understanding the mechanical behavior of the interface between the metal film and the substrate as well as the process of crack formation under global tension is important for producing reliable devices. In the present work, the deformation behavior of copper films (50–200 nm thick), bonded to polyimide directly or via a 10 nm chromium interlayer, is investigated by experimental analysis and computational simulations. The influence of the various copper film thicknesses and the usage of a brittle interlayer on the crack density as well as on the stress magnitude in the copper after saturation of the cracking process are studied with in situ tensile tests in a synchrotron and under an atomic force microscope. From the computational point of view, the evolution of the crack pattern is modeled as a stochastic process via finite element based cohesive zone simulations. Both, experiments and simulations show that the chromium interlayer dominates the deformation behavior. The interlayer forms cracks that induce a stress concentration in the overlying copper film. This behavior is more pronounced in the 50 nm than in the 200 nm copper films.