The core-shell structured polyaniline-functionalized-BaTiO₃ (BT@PANI) nanoparticles with controllable shell layer thicknesses are developed via in-situ aniline polymerization technology and characterized in detail. The results prove that the PANI shell layer with the adjustable and controllable thicknesses of 3–10 nm are completely stabilized on the surface of the BaTiO₃ core. In addition, the BT@PANI nanoparticles are regarded as the hybrid nanofillers to prepare PEN/BT@PANI nanocomposite films with a PEN matrix. The research results indicate that the surface functionalized nanoparticles facilitate the compatibility and dispersibility of them in the PEN matrix, which improves the properties of the PEN/BT@PANI nanocomposites. Specifically, the PEN/BT@PANI nanocomposites exhibit thermal stability, excellent permittivity-frequency, and dielectric properties-temperature stability. Most importantly, the energy density of nanocomposites is maintained at over 70% at 180 °C compared with that at 25 °C. All these results reveal that a new way to prepare the high-performance PEN-based nanocomposites is established to fabricate an energy storage component in a high temperature environment.

A novel poly(arylene ether nitrile) terminated with hydroxyl groups (PEN–OH) was synthesized successfully. The effects of heat-treatment temperature on the thermal properties, mechanical properties, and dielectric properties of the PEN–OH films were studied in detail. Due to the cross-linking reaction occurring, at high temperature, among the nitrile groups on the side of the PEN–OH main chain to form a structurally stable triazine ring, the structure of materials changes from a linear structure to a bulk structure. Thus, the thermal properties and mechanical properties were improved. In addition, the occurrence of cross-linking reactions can reduce the polar groups in the material, leading to the decrease of dielectric constant. As the heat-treatment temperature increased, the glass-transition temperature increased from 180.6 °C to 203.6 °C, and the dielectric constant decreased from 3.4 to 2.8 at 1 MHz. Proper temperature heat-treatment could improve the tensile strength, as well as the elongation, at the break of the PEN–OH films. Moreover, because of the excellent adhesive property of PEN–OH to copper foil, a double-layer flexible copper clad laminate (FCCL) without any adhesives based on PEN–OH was prepared by a simple hot-press method, which possessed high peel strength with 1.01 N/mm. Therefore, the PEN–OH has potential applications in the electronic field.