Researchers in the field of the selective catalytic reduction (SCR) of nitrogen oxides (NO_x: NO, NO₂, or N₂O) by NH₃ are still greatly challenging the optimization of low-temperature activity and selectivity, high-temperature stability, resistance to alkali metals and other poisoning agents, such as Hg, As, etc. The present study reviews the research progress, related to the latest 20 years, on WO₃–V₂O₅-based catalysts that are expected to overcome the catalytic performances of the current SCR catalytic devices. In details, the effects of the synthesis methods, chemical composition, type of supports (metal oxides, molecular sieves, and filters), doping elements, or metal oxides added as promoters of WO₃–V₂O₅-based catalysts and, finally, the influence of SO₂ and H₂O in the reaction mixture are addressed. The importance of understanding the deactivation mechanism in the presence of several poisoning agents is also emphasized, which should be taken into consideration for the design of new catalysts.

One-dimensional silver nanowires (AgNWs) and two-dimensional graphene oxide (GO) were combined to construct a three-dimensional network structure. The AgNWs can effectively inhibit stacking of adjacent GO sheets by occupying regions between layers of GO. Moreover, the GO sheets embedded in the gaps of the AgNWs network increase the interfacial contact area between the AgNWs and the epoxy matrix, resulting in the formation of more efficient phonon transport channels. To prepare an epoxy-based thermal conductive composite, hybrid networks were fabricated and added to epoxy resin using a solution mixing method. Significant synergistic effects were observed between the AgNWs and GO sheets. The thermal conductivity of epoxy composites filled with 10 wt.% AgNW/GO hybrids was found to be 1.2 W/mK and the impact strength was 28.85 KJ/m², which are higher than the corresponding values of composites containing AgNWs or GO sheets alone. Thus, the thermal conductivity and impact strength of the epoxy composites were improved. The additive effects are mainly owing to the improved interfacial contact between the hybrid fillers and the epoxy resin, resulting in a more efficient phonon transport network. The use of hybrid fillers with different structures is a simple and scalable strategy for manufacturing high-performance thermally conductive materials for electronic packaging.