Flip-chip microbump (μ-bump) bonding technology between indium phosphide (InP) and silicon carbide (SiC) substrates for a millimeter-wave (mmW) wireless communication application is demonstrated. The proposed process of flip-chip μ-bump bonding to achieve high-yield performance utilizes a SiO₂-based dielectric passivation process, a sputtering-based pad metallization process, an electroplating (EP) bump process enabling a flat-top μ-bump shape, a dicing process without the peeling of the dielectric layer, and a SnAg-to-Au solder bonding process. By using the bonding process, 10 mm long InP-to-SiC coplanar waveguide (CPW) lines with 10 daisy chains interconnected with a hundred μ-bumps are fabricated. All twelve InP-to-SiC CPW lines placed on two samples, one of which has an area of approximately 11 × 10 mm², show uniform performance with insertion loss deviation within ±10% along with an average insertion loss of 0.25 dB/mm, while achieving return losses of more than 15 dB at a frequency of 30 GHz, which are comparable to insertion loss values of previously reported conventional CPW lines. In addition, an InP-to-SiC resonant tunneling diode device is fabricated for the first time and its DC and RF characteristics are investigated.

Powerful sunlight, a high water temperature, and stagnation in the water flow induce eutrophication in rivers and lakes, which destroys the aquatic ecosystem and threatens the downstream water supply systems. Accordingly, it is very important to perform real-time measurements of nutrients that induce algal growth, especially total phosphorus, to preserve and manage the aquatic ecosystem. To conduct quantitative analysis of the total phosphorus in the aquatic ecosystem, it is essential to perform a pretreatment process and quickly separate the phosphorus, combined with organic and inorganic materials, into a phosphate. In this study, the sandblasting process was used for the physical etching of the wafer, and photocatalytic materials were deposited on the surface with various roughness in order to improve the photocatalytic reaction surface and efficiency. The photocatalytic reaction was applied to combine the pretreated sample with the coloring agent for color development, and the absorbance of the colored sample was analyzed quantitatively to compare and evaluate the characteristics, followed by the surface increase in the photocatalytic materials. In addition, the pretreatment and measurement parts were materialized in a single chip to produce a small and light total phosphorus analysis sensor.

Phosphorus, an essential rare element in aquatic ecosystems, plays a key role in maintaining ecosystem balance. However, excess phosphorus leads to eutrophication and algal proliferation. To prevent eutrophication, the pretreatment and measuring of the concentration of total phosphorus (TP) is crucial. Compared to conventional TP pretreatment equipment (autoclave), a lab-on-a-chip detection device fabricated using micro-electromechanical system technology and titania (TiO₂) as a photocatalyst is more convenient, efficient, and cost-effective. However, the wide bandgap of TiO₂ (3.2 eV) limits photocatalytic activity. To address this problem, this paper describes the preparation of a TiO₂/Au nanocomposite film using electron-beam evaporation and atomic-layer deposition, based on the introduction of gold film and TiO₂ to a quartz substrate. The photocatalytic degradation properties of TiO₂/Au nanocomposite films with thicknesses of 1, 2, 3, and 4 nm were assessed using rhodamine B as a pollutant. The experimental results demonstrate that the deposition of gold films with different thicknesses can enhance photocatalytic degradation efficiency through synergetic reactions in the charge separation process on the surface. The optimal photocatalytic efficiency is achieved when the deposition thickness is 2 nm, and it decreases with further increase in the thickness. When the photocatalytic reaction time is 15 min, the lab-on-a-chip (LOC) device with a 2-nm-thick gold layer and autoclave exhibits a similar TP pretreatment performance. Therefore, the proposed LOC device based on photocatalytic technology can address the limitations of conventional autoclave equipment, such as large volumes, long processing times, and high costs, thereby satisfying the growing demand for on-site evaluation.

Phosphorus, an essential rare element in aquatic ecosystems, plays a key role in maintaining ecosystem balance. However, an excess of phosphorus will lead to eutrophication and algal pro-liferation. To prevent eutrophication, it is crucial to pretreat and measure the concentration of total phosphorus (TP). Compared with conventional TP pretreatment equipment (autoclave), a lab-on-a-chip detection device fabricated through micro-electromechanical system technology using titania (TiO2) as a photocatalyst is more convenient, efficient, and cost-effective. However, the wide bandgap of TiO2 (3.2 eV) limits the photocatalytic activity. To address this problem, this paper describes the preparation of a TiO2/Au nanocomposite film by electron-beam evaporation and atomic layer deposition, based on the introduction of a gold film and TiO2 on a quartz substrate. The photocatalytic degradation properties of TiO2/Au nanocomposite films with thicknesses of 1, 2, 3, and 4 nm are assessed using rhodamine B as a pollutant. Experimental results demonstrate that the deposition of a gold film with different thicknesses can enhance the photocatalytic degradation efficiency through synergetic reactions in the charge separation process on the surface. The optimal photocatalytic efficiency is achieved when the deposition thickness is 2 nm, and it decreases with further increase in the thickness. When the photocatalytic reaction time is 15 min, the LOC device with a 2-nm-thick gold layer and autoclave exhibit similar TP pretreatment performance. Therefore, the proposed LOC device based on photocatalysis technology can address the limitation of conventional autoclave equipment, such as large volume, long processing time, and high cost, thereby satisfying the growing demand for on-site evaluation.