Magnetic sensors are widely used in our daily life for assessing the position and orientation of objects. Recently, the magnetic sensing modality has been introduced to electronic skins (e-skins), enabling remote perception of moving objects. However, the integration density of magnetic sensors is limited and the vector properties of the magnetic field cannot be fully explored since the sensors can only perceive field components in one or two dimensions. Here, we report an approach to fabricate high-density integrated active matrix magnetic sensor with three-dimensional (3D) magnetic vector field sensing capability. The 3D magnetic sensor is composed of an array of self-assembled micro-origami cubic architectures with biased anisotropic magnetoresistance (AMR) sensors manufactured in a wafer-scale process. Integrating the 3D magnetic sensors into an e-skin with embedded magnetic hairs enables real-time multidirectional tactile perception. We demonstrate a versatile approach for the fabrication of active matrix integrated 3D sensor arrays using micro-origami and pave the way for new electronic devices relying on the autonomous rearrangement of functional elements in space.

A novel method relying on strain engineering to realize arrays of on‐chip‐integrated giant magneto‐impedance (GMI) sensors equipped with pick‐up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography.

High‐performance giant magnetoresistive (GMR) sensorics are realized, which are printed at predefined locations on flexible circuitry. Remarkably, the printed magnetosensors remain fully operational over the complete consumer temperature range and reveal a giant magnetoresistance up to 37% and a sensitivity of 0.93 T⁻¹ at 130 mT. With these specifications, printed magnetoelectronics can be controlled using flexible active electronics for the realization of smart packaging and energy‐efficient switches.

Imperceptible magnetic sensor matrix system realizes real-time mapping of 2D magnetic field distribution.

Modern microelectronic systems and their components are essentially 3D devices that have become smaller and lighter in order to improve performance and reduce costs. To maintain this trend, novel materials and technologies are required that provide more structural freedom in 3D over conventional microelectronics, as well as easier parallel fabrication routes while maintaining compatability with existing manufacturing methods. Self‐assembly of initially planar membranes into complex 3D architectures offers a wealth of opportunities to accommodate thin‐film microelectronic functionalities in devices and systems possessing improved performance and higher integration density. Existing work in this field, with a focus on components constructed from 3D self‐assembly, is reviewed, and an outlook on their application potential in tomorrow's microelectronics world is provided.