Yang Liu

Prof. Yang Liu


Research Focus & Metrics

Academic Career Length

19Years (2008-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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26 March 2018 in IEEE Transactions on Device and Materials Reliability
Verified
Journal Article
Closed access
YLYang Liu
Yang Liu
HZHao Zhang
Hao Zhang
LWLingen Wang
Lingen Wang
XFXuejun Fan
Xuejun Fan
GZGuoqi Zhang
Guoqi Zhang
FSFenglian Sun
Fenglian Sun
The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the thickness and the porosity of the sintering layer decreased when the sintering pressure varied from 5 MPa to 30 MPa. This densification phenomenon facilitated the enhancement of the Ag sintering layers. The shear strength was improved significantly from 44.19 MPa to 69.41 MPa when the sintering pressure increased from 5 MPa to 10 MPa. When the sintering pressure ranged from 10 MPa to 30 MPa, the shear strength presented a slow increase from 69.41 MPa to 73.38 MPa. According to the results of the failure analysis, fracture mode transformation was considered as the basic reason for this phenomenon. The increasing sintering pressure promoted the bonding of the nano-Ag particles during the sintering process. Consequently, the fracture of the sintered-Ag layer transformed from brittle fracture to ductile fracture because of the increasing sintering pressure. The delamination area between Cu and Ni layers coated on the bottom Mo plate was clearly enlarged with the increasing sintering pressure. The delamination between Cu and Ni layers coated on the bottom Mo plate turned to be the main failure mode when the sintering pressure was higher than 10 MPa.

6 April 2014 in Journal of Materials Science: Materials in Electronics
Verified
Journal Article
Closed access
PDF file
YLYang Liu
Yang Liu
FSFenglian Sun
Fenglian Sun
XLXuemei Li
Xuemei Li

1 September 2014 in Microelectronics Reliability
Verified
Journal Article
Closed access
YLYang Liu
Yang Liu
SLStanley Y.Y. Leung
Stanley Y.Y. Leung
JZJia Zhao
Jia Zhao
CWCell K.Y. Wong
Cell K.Y. Wong
CYCadmus A. Yuan
Cadmus A. Yuan
LLLiangliang Luo
Liangliang Luo

1 December 2016 in Journal of Materials Processing Technology
Verified
Journal Article
Closed access
YLYang Liu
Yang Liu
HFHaifeng Fu
Haifeng Fu
FSFenglian Sun
Fenglian Sun
HZHao Zhang
Hao Zhang
XKXiangxia Kong
Xiangxia Kong
TXTong Xin
Tong Xin

12 February 2012 in Journal of Materials Science: Materials in Electronics
Verified
Journal Article
Closed access
PDF file
YLYang Liu
Yang Liu
FSFenglian Sun
Fenglian Sun
HZHongwu Zhang
Hongwu Zhang
PZPengfei Zou
Pengfei Zou

28 January 2021 in Journal of Nanoparticle Research
Verified
Journal Article
Closed access
PDF file
SLShizhen Li
Shizhen Li
YLYang Liu
Yang Liu
FSFenglian Sun
Fenglian Sun
HFHongyuan Fang
Hongyuan Fang