In this paper synthesis and extensive investigation of the microstructural and optoelectronic properties of polyaniline (PANI), Multiwalled carbon nanotube (MWCNTs) and MWCNTs reinforced PANI composites is presented. MWCNTs- PANI composites have been deposited by spin coating on silicon wafer substrate. Fourier Transform Infrared Spectroscopy shows no difference between PANI and its composites. However a change in peaks shape and absorption intensity has been observed. A strong effect of the MWCNTs weight percentage on the PANI/MWCNTs composites has been demonstrated. It was find that the thermal stability improved with increasing MWCNTs content. The optical band gap of the PANI thin films has been effectively tuned from 2.38 to 1.78 eV as the MWCNTs content increases from 5 to 15 wt.% The Current–voltage (I–V) characteristics of the fabricated devices shows a significant improvement in current with MWCNTs weight percentage content. It was observed a strong enhancement of composite in the conductivity as well as in the current level. The microscopic images show that the dispersion of MWCNTs into PANI leads to the formation a new conductive pathway.

To enhance interfacial bonding between carbon fibers and epoxy matrix, the carbon fibers have been modified with multiwall carbon nanotubes (MWCNTs) using the dip- coating technique. FT-IR spectrum of the MWCNTs shows a peak at 1640 cm ⁻¹ corresponding to the stretching mode of the C=C double bond which forms the framework of the carbon nanotube sidewall. The broad peak at 3430 cm ⁻¹ is due to O–H stretching vibration of hydroxyl groups and the peak at 1712 cm ⁻¹ corresponds to the carboxylic (C=O) group attached to the carbon fiber. The peaks at 2927 cm ⁻¹ and 2862 cm ⁻¹ are assigned to C–H stretching vibration of epoxy produced at the defect sites of acid-oxidized carbon fiber surface. SEM image shows a better interface bonding between the fiber and the matrix of modified composites (MWCNTs-CF/Ep) than those of unmodified composite. The loss factor curve of CF-MWCNTs/Ep composites is the narrowest compared with neat epoxy and CF/Ep composites which evinces that the length distribution range of molecular chain segments in the matrix is the narrowest. From the dependence of the AC conductivity on temperature, we can see that σ _AC increases when temperature increases. The increase in electrical conductivity of the composites may be a result of the increased chain ordering due to annealing effect. The use of MWCNTs to modify the surface of carbon fiber resulted in a large amount of junctions among MWCNT causing an increase in the electrical and thermal conductivity by forming conducting paths in the matrix. The MWCNTs-CF/Ep composite shows better thermal stability than unmodified composites. The strong interaction between CF and MWCNTs can retard diffusion of small molecules from the resin matrix at high temperature and hence, result in the improved thermal stability of the modified CF/Ep composite.

The silicon carbide/carbon fiber (SiC/CF) hybrid fillers were introduced to improve the electrical and thermal conductivities of the epoxy resin composites. Results of Fourier transform infrared spectroscopy revealed that the peaks at 3532 and 2850 cm ⁻¹ relate to carboxylic acid O–H stretching and aldehyde C–H stretching appearing deeper with an increased volume fraction of SiC. Scanning electron microscopic image shows a better interface bonding between the fiber and the matrix when the volume fraction of SiC particles are increased. As frequency increases from 10 ² Hz to 10 ⁶ Hz, dielectric constants decrease slightly. Dissipation factor (tan δ) values keep low and almost constant from 10 ² Hz to 10 ⁴ Hz, has a slight increase after 10 ⁴ Hz, and obtain relaxation peaks approximately between 10 ⁵ and 10 ⁶ Hz. A sharp increase in dielectric constant and dissipation factors is observed in epoxy (Ep)/CF composites with 30 vol.% of SiC. The increase in electrical conductivity of composites may result from the increased chain ordering by annealing effect. The electrical conductivities of the Ep/CF composites are decreasing with the increasing volume fraction of SiC. It is attributed to the introduction of insulating SiC. The glass transition temperature ( T _g ) of the Ep/CF-30 vol.% SiC composite was 352 C, which was higher than other composites. The decomposition temperature at 5% weight loss, decomposition temperature at 10% weight loss, and maximum decomposition temperature of the Ep/CF-30 vol.% SiC composite were about 389.5°C, 410.7°C, and 591°C, respectively, and were higher than pure epoxy and other composites. A higher thermal conductivity of 1.86 W (m K) ⁻¹ could be achieved with 30 vol.% SiC/CF hybrid fillers, which is about nine times higher than that of native epoxy resin of 0.202 W (m.K) ⁻¹ .

Polyimide/MWCNTs nanocomposites have been fabricated by solution mixing process. In the present study, we have investigated electrical conductivity and dielectric properties of PI/MWCNT nanocomposites in frequency range of 1 kHz to 100 kHz at different MWCNTs concentrations from 0 wt.% to 15 wt.%. It has been observed that the electrical conductivity and dielectric constants are enhanced significantly by several orders of magnitude up to 15 wt.% of MWCNTs content. The electrical conductivity increases as the frequency is increased, which can be attributed to high dislocation density near the interface. The rapid increase in the dielectric constant at a high MWCNTs content can be explained by the formation of a percolative path of the conducting network through the sample for a concentration corresponding to the percolation threshold. The high dielectric constant at a low frequency (1 kHz) is thought to originate from the space charge polarization mechanism. I-V characteristics of these devices indicate a significant increase in current with an increase in multi-walled carbon nanotube concentration in the composites. The SEM images show improved dispersion of MWCNTs in the PI matrix; this is due to the strong interfacial interactions.