For a complementary metal-oxide-semiconductor image sensor with highly linear, low noise and high frame rate, the nonlinear correction and frame rate improvement techniques are becoming very important. The in-pixel source follower transistor and the integration capacitor on the floating diffusion node cause linearity degradation. In order to address this problem, this paper proposes an adaptive nonlinear ramp generator circuit based on dummy pixels used in single-slope analog-to-digital converter topology for a complementary metal-oxide-semiconductor (CMOS) image sensor. In the proposed approach, the traditional linear ramp generator circuit is replaced with the new proposed adaptive nonlinear ramp generator circuit that can mitigate the nonlinearity of the pixel unit circuit, especially the gain nonlinearity of the source follower transistor and the integration capacitor nonlinearity of the floating diffusion node. Moreover, in order to enhance the frame rate and address the issue of high column fixed pattern noise, a new readout scheme of fully differential pipeline sampling quantization with a double auto-zeroing technique is proposed. Compared with the conventional readout structure without a fully differential pipeline sampling quantization technique and double auto-zeroing technique, the proposed readout scheme cannot only enhance the frame rate but can also improve the consistency of the offset and delay information of different column comparators and significantly reduce the column fixed pattern noise. The proposed techniques are simulated and verified with a prototype chip fabricated using typical 180 nm CMOS process technology. The obtained measurement results demonstrate that the overall nonlinearity of the CMOS image sensor is reduced from 1.03% to 0.047%, the efficiency of the comparator is improved from 85.3% to 100%, and the column fixed pattern noise is reduced from 0.43% to 0.019%.

The application requirements of high frame rate CMOS image sensors (CIS) in the industry have not been satisfied due to the speed limitations in traditional single-slope and serial two-step analog-to-digital converters (ADCs). In this paper, a high-speed fully differential two-step ADC design method for CIS was proposed. The proposed method was based on differential ramp and time-to-digital conversion (TDC) technology. A parallel conversion mode was formed that is different from serial conversion, and the robustness of the system was ensured due to the existence of differential ramps. Aiming at the inconsistency between traditional TDC technology and single-slope ADC, a TDC technology based on level coding was proposed. The proposed technology achieves the TDC in the last clock cycle of analog-to-digital conversion, and realized a two-step conversion process at another level. This paper presents a complete circuit design, layout design, and test verification of the proposed design method based on the 55 nm 1P4M CMOS experimental platform. Under the design environment of the analog voltage of 3.3 V, the digital voltage of 1.2 V, the clock frequency of 100 MHz, and a dynamic input range of 1.6 V, this design was a 12-bit ADC with a conversion time of 480 ns, column-level power consumption of 62 μW, differential nonlinearity (DNL) of +0.6/−0.6 LSB, and integral nonlinearity (INL) of +1.2/−1.4 LSB. Furthermore, it achieved a signal-to-noise distortion ratio (SNDR) of 70.08 dB. The proposed design provided a large area array with a high frame rate, and compared with the existing advanced single-slope ADC, its conversion speed increased by more than 52%. It provides an effective solution for the implementation of high frame frequency CIS

An improved global shutter pixel structure with extended output range and linearity of compensation is proposed for CMOS image sensor. The potential switching of the sample and hold capacitor bottom plate outside the array is used to solve the problem of the serious swing limitation, which will attenuate the dynamic range of the image sensor. The non‐linear problem caused by the substrate bias effect in the output process of the pixel source follower is solved by using the mirror FD point negative feedback self‐establishment technology outside the array. The approach proposed in this paper has been verified in a global shutter CMOS image sensor with a scale of 1024×1024 pixels. The test results show that the output range is expanded from 0.95V to 2V, and the error introduced by the nonlinearity is sharply reduced from 280mV to 0.3mV. Most importantly, the output range expansion circuit does not increase the additional pixel area and the power consumption. The power consumption of linearity correction circuit is only 23.1μW, accounting for less than 0.01% of the whole chip power consumption.

Aiming at the impact of load current change on single-event transient, the essential difference between single-event transient and load transient of DC-DC converter is deeply studied. A hardened circuit based on load transient detection is proposed. The circuit detects the load transient information in time and outputs a control signal to control the single event hardened circuit, thereby realizing the improvement of the transient characteristics of the system under dynamic conditions. Based on the 180 nm bipolar-CMOS-DMOS (BCD) process, the design and physical verification of a boost converter are completed. The experimental results show that the input voltage range is 2.9-4.5 V, the output voltage range is 5.8-7.9 V, and the load current is 0–55 mA. During load transients, the load detection circuit turns off the hardened circuit in time, avoiding system oscillation and widening the dynamic range of the hardening circuit. Under the single-event transient, the output voltage fluctuation of the system does not exceed the maximum ripple voltage, and the single-event transient suppression ability reaches more than 86%, the system can work well with linear energy transfer of about $100\ \text{MeV}\cdot \text{cm}^{2}/\text{mg}$ .