Monitoring the temperature of a semiconductor component allows for the prediction of potential failures, optimization of the selected cooling system, and extension of the useful life of the semiconductor component. There are many methods of measuring the crystal temperature of the semiconductor element referred to as a die. The resolution and accuracy of the measurements depend on the chosen method. This paper describes known methods for measuring and imaging the temperature distribution on the die surface of a semiconductor device. Relationships are also described that allow one to determine the die temperature on the basis of the case temperature. Current trends and directions of development for die temperature measurement methods are indicated.

The number of components of a thermographic temperature measurement uncertainty budget and their ultimate contribution depend on the conditions in which the measurement is performed. The acquired data determine the accuracy with which the uncertainty component is estimated. Unfortunately, when some factors have to be taken into account, it is difficult to determine the value of the uncertainty component caused by the occurrence of this factor. In the case of a thermographic temperature measurement, such a factor is the lack of sharpness of the registered thermogram. This problem intensifies when an additional macro lens must be used. Therefore, it is decided to commence research to prepare an uncertainty budget of thermographic measurement with an additional macro lens based on the B method described in EA-4/02 (European Accreditation publications). As a result, the contribution of factors in the uncertainty budget of thermographic measurement with additional macro lens and the value of expanded uncertainty were obtained.

This article concerns the indirect thermographic temperature measurement of a die of the semiconductor diode D00-250-10. The article shows how the goal was achieved. The methodology of selecting the point at which thermographic measurements of the temperature of the diode cases were performed is discussed. The method of thermographic measurement of the case temperature and the measuring system used is described. The method of simulations making it possible to obtain the die’s temperature on the basis of thermographic casing temperature measurement is presented. In order to enable a better understanding of the discussed issues, the construction of the diode used and the heat flow equation are described. As a result of the work carried out, the point at which the temperature is closest to the die temperature was indicated on the diode case. It is shown that the difference between the casing temperature and the die temperature does not exceed 2 °C at the point indicated. An indirect measurement of the die’s temperature is carried out for different values of the power dissipated on the die.

This article describes the measuring system and the influence of selected factors on the accuracy of thermographic temperature measurement using a macrolens. This method enables thermographic measurement of the temperature of a small object with an area of square millimeters as, e.g., electronic elements. Damage to electronic components is often preceded by a rise in temperature, and an effective way to diagnose such components is the use of a thermographic camera. The ability to diagnose a device under full load makes thermography a very practical method that allows us to assess the condition of the device during operation. The accuracy of such a measurement depends on the conditions in which it is carried out. The incorrect selection of at least one parameter compensating the influence of the factor occurring during the measurement may cause the indicated value to differ from the correct value. This paper presents the basic issues linked to thermographic measurements and highlights the sources of errors. A measuring stand which enables the assessment of the influence of selected factors on the accuracy of thermographic measurement of electronic elements with the use of a macrolens is presented.

Work temperature is a factor, which has a strong influence on the work of a semiconductor electronic element. Operation of an electronic element in an excessive temperature causes the element not to work correctly. For this reason, monitoring the temperature of the element is necessary. One of the methods, which allows the monitoring of electronic element temperature is thermography. This non-contact method can also be used during the operation of the electronic element. The reading of a thermal camera depends on several factors. One of these factors is the sharpness of the registered thermograms. For this reason, research was carried out to develop a simple tool that allows a clear classification of thermograms of electronic elements into sharp and unsharp thermograms. In the research carried-out, the sharpness of the registered thermograms of electronic elements was determined by different sharpness measures. In the research, it was shown that in the case of thermograms classified as sharp, a smaller error of temperature measurement was obtained with the use of a thermal imaging camera.

An excessive increase in reactive power consumption is unfavorable from the point of view of a power system. For this reason, devices compensating reactive power consumption are used. The capacitor is one such device. Capacitors must be tested regularly during their exploitation. One of the activities that should be performed is testing the degree of heating of the cells of a capacitor bank. Thermography can be used to perform such tests. This non-contact method has its limitations. Due to the angular emissivity and the change in the distance between the lens and the object under observation, the temperature measured with a thermographic camera may differ from the actual temperature. This phenomenon is visible on cylindrical capacitor cases. Consequently, depending on the location of the observation point on the capacitor case, the result of the thermographic temperature measurement may be different. To investigate this phenomenon, experimental work has been undertaken.