A palm‐sized antenna is proposed for the hybridisation of fifth generation (5G) and long‐term evolution‐advanced (LTE‐A) communication modes. The antenna has the overall volume of 70 mm ( l ) × 40 mm ( w ) × 0.254 mm ( h ) clutched by four multiple‐input–multiple‐output chip antennas (CAs) operating at 2.4 GHz for LTE‐A on the sides of a flat substrate integrated waveguide (SIW) four‐by‐four Butler matrix (BM) beamforming antenna operating over the band from 27 to 29 GHz for 5G communication. Advantages are the broad bandwidth gained by a low‐profile BM and this metal SIW structure of high isolation above 10 dB with neighbouring CAs, which is impossible for the microstrip BM and coplanar waveguide (CPW) version. The simulated and measured results of the impedance matching as well as the gains and radiated field patterns of all the ports reveal the antenna is proper for the multi‐mode communication as a compact geometry. Besides, high isolation between the closely placed radiating elements is observed.

In this paper, a new design method is proposed for a planar and compact dual-band dipole antenna. The dipole antenna has arms as a hybrid CRLH (Composite right- and left-handed) transmission-line comprising distributed and lumped elements for the dual-band function. The two arms are fed by the outputs of a compact and printed CRLH dual-band balun which consists of a CRLH hybrid coupler and an additional CRLH phase-shifter. Its operational frequencies are 2.4 and 5.2 GHz as popular mobile applications. Verifying the method, the circuit approach, EM (Electromagnetics) simulation and measurement are conducted and their results turn out to agree well with each other. Additionally, the CRLH property is shown with the dispersion diagram and the effective size-reduction is mentioned.

In this paper, a new sensor is developed to estimate the dielectric constant of Cyclo Olefin Polymer (COP) film utilizable for 5G mobile phones’ multi-layered back-cover. It is featured by the electrical characterization of the thin layer of the COP film at 28 GHz as the material under test (MUT) directly contacting the planar probe (which is an array of resonating patches) and a new meta-surface as metal patterned on the COP film inserted between the planar probe and the 5G multi-layered back-cover for enhanced physical interpretation of the data by way of impedance matching. In this approach to delving into the material, a thin and small meta-surface film with an area of 25.65 × 21.06 mm² and a thickness of 55 μm is examined for applications to 5G mobile 28 GHz-frequency communication on the basis of the below −10 dB-impedance matching for the 1-by-4 array sensor. Along with this, the real and commercial handset back-cover is brought to the test. The proposed method presents the advantages of geometrical adequacy to the realistic 5G handset antenna configuration, the idea of impedance-matching via meta-materials, and the suitability of characterizing the film-type structure as compared to the open-ended coaxial waveguide, waveguide-to-waveguide and TX horn-to-RX horn free-space test methods.

In this paper, an intuitive approach to assessing advantages of beamforming in 5G wireless communication is proposed as a novel try and practical demonstration of importance of alignment between the transmitter’s and receiver’s beams working in millimeter-wave frequency bands. Since the diffraction loss of millimeter-wave signals matters seriously in propagation, the effects of the misalignment and alignment between beams need to be checked for, which was conducted with a horn antenna and the 4 × 4 Butler matrix which mimic the relationship of the base station and handset antennas. Designing and using the microstrip-line and the substrate integrated waveguide (SIW) Butler matrices, RF-to-RF wireless connectivity between the horn and the microstrip line beamformer as case 1 and the horn and the SIW beamformer as case 2, concerning the changing angle of the beam from either of the two Butler matrices, was tested, showing over 12 dB enhancement in received power. This direct electromagnetic link test was accompanied by examining 64-QAM constellations for beam-angle changing from −30° to +30° for the two cases, where the error vector magnitude in the QAM-diagram becomes less than 10% by beam-alignment for the changing angle.

In this paper, a novel chip antenna and its function in wireless connectivity are presented for Bluetooth (BLT) earphones. The chip antenna is a metamaterial so compact (<λ/8), as the size of 4.9 × 13.0 × 2.0 mm³, that when it is mounted on the realistic PCB, it can be held in the enclosure of the BLT earphone. This setting does not degrade the resonance (S₁₁ < −10 dB) of the proposed antenna. As two earphones in a pair are demanded to communicate with each other, one shares an RF signal with the other and they take turns as the master and slave. The received signal sensing is conducted with the latest model of human head-ear-phantom located between the earphones to mimic the real use-case and cross-head interference. Electromagnetic simulation of the antenna is done and verified by fabrication and measurement. Particularly, received-signal strength indications between the proposed antennas in the earphones are experimentally obtained as −67.5 dBm and −70 dBm without and with the head-ear-phantom, respectively, much greater than −120 dBm, the limit of detection, and implying acceptable connectivity and invulnerability over cross-head-interference problems.