Copper and copper‐based materials are widely used in power electronics, automobiles, mechanical manufacturing and high‐tech manufacturing fields such as aerospace, telecommunications and integrated circuits owing to their comprehensive advantages in mechanical, electrical conductivity and processing properties. With the rapid development of technology, many emerging technical fields have introduced more challenging requirements for the electrical conductivity of copper. This article reviews the research status of high‐conductivity copper‐based materials and introduces three methods to improve electrical conductivity, including purification, alloying and addition of nanocarbon materials. We summarise the advantages, disadvantages and future development trends of methods for improving copper conductivity. The key to producing high‐conductivity copper‐based materials is development of low‐cost, continuous and stable processes.

The microstructure and 650 °C tensile behavior of Ti-6·5Al-2Sn- 4Zr-xMo-2Nb-1W-0·2Si high temperature titanium alloys with different contents of Mo were systematically investigated. The results showed that Mo was mainly solubilised in β phase, and the concentration of Mo in α phase was much less than Nb. Microstructure observations indicated an obvious reduction in the size of transformed β structure (β_t), primary α phase (α_p) and the thickness of secondary lamellar α phase (α_L), with the increase of Mo addition. It was also observed that adding more Mo could improve ultimate tensile strength and elongation (EL) at 650 °C, but reduce the yield strength (YS). Deformation behaviors of the alloys with different contents of Mo were researched by the analysis of respective dislocation morphologies. Compared to the 2% Mo alloy, the 4% Mo alloy had more β phase, smaller α_p and finer α_L, which could activate more dislocation slip systems and cross slip due to their excellent accommodative deformation capabilities during 650 °C tensile deformation process.