Chih-Hung Chung

Mr. Chih-Hung Chung

Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
orcid

Research Focus & Metrics

Academic Career Length

5Years (2022-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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8 March 2023 in ACS Omega
Verified
Journal Article
Open access
CCChih-Hung Chung
Chih-Hung Chung
HCHong-Ren Chen
Hong-Ren Chen
MHMeng-Ju Ho
Meng-Ju Ho
CLChiung-Yuan Lin
Chiung-Yuan Lin
Reducing the contact resistance is one of the major challenges in developing transistors based on two-dimensional materials. In this study, we perform first-principles quantum-transport calculations by adopting a novel type of partially sulfur-replaced edge contact metal/WSX/WS2 in order to lower the Schottky barrier height and in turn reduce the contact resistance. Here, the sulfur replacements produce a segment of the metamaterial WSX (X = P, As, F, and Cl), using group V or halogen atoms to substitute sulfur atoms on one side of a WS2 monolayer. We further compare the effects of such sulfur replacements on the interface metallization and bonding. Such WSX-buffered contacts exhibit contact resistances as low as 142 and 173 Ω·μm for the p-type Pt/WSP/WS2 and n-type Ti/WSCl/WS2 edge contacts, respectively. Moreover, ab initio molecular dynamics is employed to observe a stable standalone WSX monolayer at room temperature.

1 June 2024 in Materials
Verified
Journal Article
Open access
PDF file
CCChih-Hung Chung
Chih-Hung Chung
CLChiung-Yuan Lin
Chiung-Yuan Lin
HLHsien-Yang Liu
Hsien-Yang Liu
SNShao-En Nian
Shao-En Nian
YCYu-Tzu Chen
Yu-Tzu Chen
CTCheng-En Tsai
Cheng-En Tsai
2D field-effect transistors (FETs) fabricated with transition metal dichalcogenide (TMD) materials are a potential replacement for the silicon-based CMOS. However, the lack of advancement in p-type contact is also a key factor hindering TMD-based CMOS applications. The less investigated path towards improving electrical characteristics based on contact geometries with low contact resistance (RC) has also been established. Moreover, finding contact metals to reduce the RC is indeed one of the significant challenges in achieving the above goal. Our research provides the first comparative analysis of the three contact configurations for a WSe2 monolayer with different noble metals (Rh, Ru, and Pd) by employing ab initio density functional theory (DFT) and non-equilibrium Green’s function (NEGF) methods. From the perspective of the contact topologies, the RC and minimum subthreshold slope (SSMIN) of all the conventional edge contacts are outperformed by the novel non-van der Waals (vdW) sandwich contacts. These non-vdW sandwich contacts reveal that their RC values are below 50 Ω∙μm, attributed to the narrow Schottky barrier widths (SBWs) and low Schottky barrier heights (SBHs). Not only are the RC values dramatically reduced by such novel contacts, but the SSMIN values are lower than 68 mV/dec. The new proposal offers the lowest RC and SSMIN, irrespective of the contact metals. Further considering the metal leads, the WSe2/Rh FETs based on the non-vdW sandwich contacts show a meager RC value of 33 Ω∙μm and an exceptional SSMIN of 63 mV/dec. The two calculated results present the smallest-ever values reported in our study, indicating that the non-vdW sandwich contacts with Rh leads can attain the best-case scenario. In contrast, the symmetric convex edge contacts with Pd leads cause the worst-case degradation, yielding an RC value of 213 Ω∙μm and an SSMIN value of 95 mV/dec. While all the WSe2/Ru FETs exhibit medium performances, the minimal shift in the transfer curves is interestingly advantageous to the circuit operation. Conclusively, the low-RC performances and the desirable SSMIN values are a combination of the contact geometries and metal leads. This innovation, achieved through noble metal leads in conjunction with the novel contact configurations, paves the way for a TMD-based CMOS with ultra-low RC and rapid switching speeds.

9 February 2024 in Nanotechnology
Verified
Journal Article
Closed access
CCChih-Hung Chung
Chih-Hung Chung
TCTing-Yu Chen
Ting-Yu Chen
CLChiung-Yuan Lin
Chiung-Yuan Lin
HCHuang-Wei Chien
Huang-Wei Chien
Realizing n- and p-type transition metal dichalcogenide (TMD)-based field-effect transistors for nanoscale complementary metal oxide semiconductor (CMOS) applications remains challenging owing to undesirable contact resistance. Quantumtransport calculations were performed by replacing single-sided Se atoms of TMD near the interface with As or Br atoms to further improve the contact resistance. Here, partial selenium replacement produced a novel interface with a segment of metamaterial MoSeX (Pt/MoSeX/MoSe2; X = As, Br). Such stable metamaterials exhibit semi-metallicity, and the contact resistance can be thus lowered. Our findings provide insights into the potential of MoSe2-based nano-CMOS logic devices.

1 December 2022 in AIP Advances
Verified
Journal Article
Open access
PDF file
CCChih-Hung Chung
Chih-Hung Chung
CLChiung-Yuan Lin
Chiung-Yuan Lin
TYTsung-Fu Yang
Tsung-Fu Yang
HHHsin-Hui Huang
Hsin-Hui Huang
THTuo-Hung Hou
Tuo-Hung Hou
BMBlanka Magyari-Köpe
Blanka Magyari-Köpe
For a resistance random access memory whose insulating matrix is based on transition metal oxides, the underlying microscopic mechanism of its conductive filaments is crucial yet challenging to understand. In this paper, our first-principles calculations predict that titanium oxide prefers its anatase phase over rutile either with or without aluminum doping. We report that an oxygen vacancy in the anatase titanium oxide is stable in its neutral charge state when free of an external field, while it is unstable in the singly and doubly charged states. By calculating the dissociation energy of a single vacancy from a conductive filament, we also study the filament rupture that is modeled by an array of oxygen vacancies, with or without a nearby aluminum dopant. We find that for the dopants at a specific site, the conductive filaments tend to disconnect, which, in turn, enhances the endurance of a non-filamentary resistance random access memory.