This paper discusses self-heating and reliability issues in FinFET and 3D ICs. In FinFET, self-heating and reliability issues are more serious as compared to other planar transistors. Self-heating issues in conventional planar transistors are controlled by moving the generated heat away down into the bulk of the device. However in FinFET, self-heating is a serious issue because of complex geometry and there is nowhere for the heat to go. Self-heating of FinFET causes many problems like increase in temperature of the metal wires which results in enhancing the electromigration effect. FinFET self-heating model and the design considerations to minimize the power dissipation in FinFET and 3D ICs are presented in this paper.