With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

Type Al-Zn-Mg alloy has a wide ranges of application in vehicles, but corrosion resistance and mechanical properties of this alloy after heat treatment or heat straightening limits its utilization. This paper investigates the effect of quenching condition during non-isothermal heat treatment on corrosion behavior and mechanical properties of Al-Zn-Mg alloy. The corrosion resistance of Al-Zn-Mg alloy decreases after non-isothermal heat treatment and the sample after air quenching has the lowest corrosion resistance, the specimens can get better corrosion resistance when suffered 5 min air cooling followed by water quenching process. The evolution of mechanical properties and corrosion resistance of heat-treated specimens is caused by the modification of distribution of precipitates at grain boundary and the microchemistry of precipitates at grain boundary, precipitate-free zones and the matrix.