Elastic ceramics: Aerogels hold promise as lightweight replacements for thermal insulation. However, poor mechanical stability has hampered progress in moving toward commercialization. Xu et al. designed a mechanical metamaterial that pinches in a small amount when you compress it (see the Perspective by Chhowalla and Jariwala). This is characteristic of materials with a negative Poisson's ratio and dramatically improves mechanical stability. The trick was using three-dimensional graphene structures to template the ceramic aerogels, thus producing a superinsulating material endowed with excellent mechanical properties. Science , this issue p. 723 ; see also p. 694

Interest in new thermal diodes, regulators, and switches has been rapidly growing because these components have the potential for rich transport phenomena that cannot be achieved using traditional thermal resistors and capacitors. Each of these thermal components has a signature functionality: Thermal diodes can rectify heat currents, thermal regulators can maintain a desired temperature, and thermal switches can actively control the heat transfer. Here, we review the fundamental physical mechanisms of switchable and nonlinear heat transfer which have been harnessed to make thermal diodes, switches, and regulators. The review focuses on experimental demonstrations, mainly near room temperature, and spans the fields of heat conduction, convection, and radiation. We emphasize the changes in thermal properties across phase transitions and thermal switching using electric and magnetic fields. After surveying fundamental mechanisms, we present various nonlinear and active thermal circuits that are based on analogies with well-known electrical circuits, and analyze potential applications in solid-state refrigeration and waste heat scavenging.

The thermal boundary conductance (TBC) of materials pairs in atomically intimate contact is reviewed as a practical guide for materials scientists. First, analytical and computational models of TBC are reviewed. Five measurement methods are then compared in terms of their sensitivity to TBC: the 3ω method, frequency- and time-domain thermoreflectance, the cut-bar method, and a composite effective thermal conductivity method. The heart of the review surveys 30 years of TBC measurements around room temperature, highlighting the materials science factors experimentally proven to influence TBC. These factors include the bulk dispersion relations, acoustic contrast, and interfacial chemistry and bonding. The measured TBCs are compared across a wide range of materials systems by using the maximum transmission limit, which with an attenuated transmission coefficient proves to be a good guideline for most clean, strongly bonded interfaces. Finally, opportunities for future research are discussed.

A rigorous derivation is given for the thermal conductivity accumulation function and mean free path (MFP) spectrum of an isotropic bulk material. The key physical insight is to express the kinetic theory integral in terms of MFP rather than frequency. Extending this framework to incorporate boundary scattering in nanostructures leads to an integral equation that transforms a material's bulk MFP spectrum into the size-dependent thermal conductivity of the nanostructure. The kernel of this transform represents the boundary scattering rule for the particular type of nanostructure. The principal benefit of this transform is that it requires only a single function, the material's bulk MFP spectrum, or equivalently its accumulation function. Explicit knowledge of the material's dispersion relation and frequency-dependent bulk MFPs is not needed, nor is a summation over polarizations, because the bulk MFP spectrum already contains this information in exactly the form required to evaluate boundary scattering. The utility of this framework is demonstrated through a case study of six models for the phonon thermal conductivity of silicon: three analytical, one gray, and two numerical.

Thermoelectric materials for power generation are typically compared using the dimensionless figure-of-merit ZT because it relates directly to the device efficiency. However, for practical applications, the cost of power generation – as governed by material, manufacturing, and heat exchanger costs – is also a critical factor which is not captured in ZT alone. The necessary analysis, derived herein, optimizes the coupled thermoelectric and economic problem for the leg length, L, and system fill factor, F, as functions of these costs. Fuel, operating, and maintenance costs are excluded. This optimization yields the minimum $ per W value for thermoelectric power generation and a framework for comparing materials beyond ZT. This analysis shows that even very expensive thermoelectric materials have the potential to be the most cost effective at the system level, if incorporated with sufficiently short legs and small fill factor. An approximate scaling analysis, verified using numerical calculations, gives the first closed-form, analytical expressions for optimal L and F to minimize $ per W. The analysis also delineates various cost-dominant regimes with different priorities for materials development, including: (i) a heat exchanger cost dominated regime, where ZT should be increased regardless of material or manufacturing costs; (ii) an areal cost, C′′, dominated regime at fixed F, where ZT/C′′ should be maximized, and (iii) a volumetric cost, C′′′, dominated regime at fixed F, where ZT/(kC′′′) should be maximized, reinforcing the need for low thermal conductivity, k. The cost–performance framework derived here will be applied to a number of real materials and applications in a separate manuscript.

Phonons can display both wave-like and particle-like behaviour during thermal transport. While thermal transport in silicon nanomeshes has been previously interpreted by phonon wave effects due to interference with periodic structures, as well as phonon particle effects including backscattering, the dominant mechanism responsible for thermal conductivity reductions below classical predictions still remains unclear. Here we isolate the wave-related coherence effects by comparing periodic and aperiodic nanomeshes, and quantify the backscattering effect by comparing variable-pitch nanomeshes. We measure identical (within 6% uncertainty) thermal conductivities for periodic and aperiodic nanomeshes of the same average pitch, and reduced thermal conductivities for nanomeshes with smaller pitches. Ray tracing simulations support the measurement results. We conclude phonon coherence is unimportant for thermal transport in silicon nanomeshes with periodicities of 100 nm and higher and temperatures above 14 K, and phonon backscattering, as manifested in the classical size effect, is responsible for the thermal conductivity reduction.