Chong Wei

Prof. Dr. Chong Wei

orcid

Research Focus & Metrics

Academic Career Length

8Years (2019-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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15 April 2024 in Ceramics
Verified
Journal Article
Open access
PDF file
LMLian Ming
Lian Ming
TWTian Wang
Tian Wang
Chong WeiChong Wei
Chong Wei
Glass properties play crucial roles in ensuring the safety and reliability of electronic packaging. However, challenges, such as thermal expansion and resistance to acid corrosion, pose long-term service difficulties. This study investigated the impact of the microstructure on acid resistance by adjusting the glass composition. A glass material with excellent acid resistance was obtained by achieving a similar coefficient of thermal expansion to tantalum; it exhibited a weight loss rate of less than 0.03% when submerged in 38% sulfuric acid at 85 °C for 200 h. Theoretically, this glass can be used to seal wet Ta electrolytic capacitors. Differential scanning calorimetry (DSC) was used to analyze the glass transition temperature and thermal stability of borosilicate glasses. X-ray diffractometry (XRD), scanning electron microscopy (SEM), and Raman spectroscopy were used to study the microstructure of the amorphous phase of the borosilicate glass, which revealed a close relationship between the degree of network phase separation in the borosilicate glass and the degree of polymerization (isomorphic polyhedron value, IP) of the glass matrix. The IP value decreased from 3.82 to 1.98 with an increasing degree of phase separation. Boron transitions from [BO4] to [BO3] within the glass network structure with increasing boron oxide content, which diminishes the availability of free oxygen provided by alkaline oxide, resulting in a lower acid resistance. Notably, the glass exhibited optimal acid resistance at boron trioxide and mixed alkaline oxide contents of 15% and 6%, respectively. Raman experiments revealed how the distributions of various bridging oxygen atoms (Qn) affect the structural phase separation of the glass network. Additionally, Raman spectroscopy revealed the depolymerization of Q4 into Q3, thereby promoting high-temperature phase separation and highlighting the unique advantages of Raman spectroscopy for phase recognition.

20 July 2023 in Composites Part B: Engineering
Verified
Journal Article
Closed access
SZSongbin Zhang
Songbin Zhang
HQHailong Qin
Hailong Qin
ZLZhuang Li
Zhuang Li
Chong WeiChong Wei
Chong Wei
CZCheng Zhang
Cheng Zhang
XLXiaoqiang Li
Xiaoqiang Li

1 November 2019 in Journal of the European Ceramic Society
Verified
Journal Article
Closed access
Chong WeiChong Wei
Chong Wei
Laurent GremillardLaurent Gremillard
Laurent Gremillard

9 March 2024 in Acta Materialia
Verified
Journal Article
Closed access
XLXingqi Liao
Xingqi Liao
MLMingqing Liao
Mingqing Liao
Chong WeiChong Wei
Chong Wei
Zhiheng HuangZhiheng Huang
Zhiheng Huang
WDWenjiu Duan
Wenjiu Duan
YZYu Zhou
Yu Zhou

30 April 2025 in Materials
Verified
Journal Article
Open access
PDF file
YLYongheng Lu
Yongheng Lu
JZJinzhuo Zhang
Jinzhuo Zhang
GLGuoquan Li
Guoquan Li
ZWZaihong Wang
Zaihong Wang
JWJing Wu
Jing Wu
Chong WeiChong Wei
Chong Wei
SiC matrix composites are widely used in high-temperature structural components of aircraft engines and nuclear reactor materials because of their excellent properties such as their high modulus, high strength, corrosion resistance, and high-temperature resistance. However, the bonding of SiCf/SiC composites poses significant challenges in practical engineering applications, primarily due to residual stresses, anisotropy in composite properties, and the demanding conditions required for high-performance joints. This work reviews various bonding technologies for SiC ceramics and SiC matrix composites. These include solid-state diffusion bonding, NITE phase bonding, direct bonding without filling materials, MAX phase bonding, glass ceramic bonding, polymer precursor bonding, metal brazing bonding, and Si-C reaction bonding. Key results, such as the highest bending strength of 439 MPa achieved with Si-C reaction bonding, are compared alongside the microstructural characteristics of different joints. Additionally, critical factors for successful bonding, such as physical mismatch and metallurgical incompatibility, are discussed in detail. Future research directions are proposed, emphasizing the optimization of bonding techniques and evaluation of joint performance in harsh environments. This review provides valuable insights into advancing bonding technologies for SiC composites in aerospace and nuclear applications.

28 August 2024 in Composites Part A: Applied Science and Manufacturing
Verified
Journal Article
Closed access
HLHaozhen Li
Haozhen Li
Chong WeiChong Wei
Chong Wei
ZCZixiong Cao
Zixiong Cao
YZYi Zhang
Yi Zhang
XLXiaoqiang Li
Xiaoqiang Li