Dongyang Hou received the B.S. degree in mechanical design manufacture and automation major from Anhui University of Science and Technology in 2019, and the M.S. degree in Mechanical design and theory major from Fuzhou University in 2022, where he is currently pursuing the Ph.D. degree in mechanical engineering major at Wuhan university. His current research interest is the study of chip packaging and testing processes based on indentation/scratch mechanics, including the development of indentation and scratch testing methods, wafer probe testing and simulation, and the reliability evaluation of electronic packaging materials, structures, and related devices.