In addition to wirelength, modern placers need to consider various constraints such as preplaced blocks and density. We propose a high-quality analytical placement algorithm considering wirelength, preplaced blocks, and density based on the log-sum-exp wirelength model proposed by Naylor and the multilevel framework. To handle preplaced blocks, we use a two-stage smoothing technique, i.e., Gaussian smoothing followed by level smoothing, to facilitate block spreading during global placement (GP). The density is controlled by white-space reallocation using partitioning and cut-line shifting during GP and cell sliding during detailed placement. We further use the conjugate gradient method with dynamic step-size control to speed up the GP and macro shifting to find better macro positions. Experimental results show that our placer obtains very high-quality results.

Unlike classical floorplanning that usually handles only block packing to minimize silicon area, modern very large scale integration (VLSI) floorplanning typically needs to pack blocks within a fixed die (outline), and additionally considers the packing with block positions and interconnect constraints. Floorplanning with bus planning is one of the most challenging modern floorplanning problems because it needs to consider the constraints with interconnect and block positions simultaneously. In this paper, the authors study two types of modern floorplanning problems: 1) fixed-outline floorplanning and 2) bus-driven floorplanning (BDF). This floorplanner uses B/sup */-tree floorplan representation based on fast three-stage simulated annealing (SA) scheme called Fast-SA. For fixed-outline floorplanning, the authors present an adaptive Fast-SA that can dynamically change the weights in the cost function to optimize the wirelength under the outline constraint. Experimental results show that this floorplanner can achieve 100% success rates efficiently for fixed-outline floorplanning with various aspect ratios. For the BDF, the authors explore the feasibility conditions of the B/sup */-tree with the bus constraints, and develop a BDF algorithm based on the conditions and Fast-SA. Experimental results show that this floorplanner obtains much smaller dead space for the floorplanning with hard/soft macro blocks, compared with the most recent work. In particular, this floorplanner is more efficient than the previous works.

Through-silicon vias (TSVs) are required for transmitting signals among different dies for the 3-D integrated circuit (IC) technology. The significant silicon areas occupied by TSVs bring critical challenges for 3-D IC placement. Unlike most published 3-D placement works that only minimize the number of TSVs during placement due to the limitations in their techniques, this paper proposes a new 3-D cell placement algorithm that can additionally consider the sizes of TSVs and the physical positions for TSV insertion during placement. The algorithm consists of three stages: 1) 3-D analytical global placement with density optimization and whitespace reservation for TSVs; 2) TSV insertion and TSV-aware legalization; and 3) layer-by-layer detailed placement. In particular, the global placement is based on a novel weighted-average (WA) wirelength model, giving the first published model that can outperform the well-known log-sum-exp wirelength model theoretically and empirically. Also, a scheme is proposed to enhance the numerical stability of the WA wirelength model. Furthermore, 3-D routing can easily be accomplished by traditional 2-D routers since the physical positions of TSVs are determined during placement. Experimental results show the effectiveness of our algorithm. Compared with state-of-the-art 3-D cell placement works, our algorithm can achieve the best routed wirelength, TSV counts, and total silicon area, in shortest running time.

A switch module M with W terminals on each side is said to be universal if every set of nets satisfying the dimensional constraint (i.e., the number of nets on each side of M is at most W ) is simultaneously rout able through M . In this article, we present a class of universal switch modules. Each of our switch modules has 6 W switches and switch-module flexibility three (i.e, F _s =3). We prove that no switch module with less than 6 W switches can be universal. We also compare our switch modules with those used in the Xilinx XC4000 family FPGAs and the antisymmetric switch modules (with F _S =3) suggested by Rose and Brown [1991]. Although these two kinds of switch modules also have F _S =3 and 6 W switches, we show that they are not universal. Based on combinatorial counting techniques, we show that each of our universal switch modules can accommodate up to 25% more routing instances, compared with the XC4000-type switch module of the same size. Experimental results demonstrate that our universal switch modules improve routability at the chip level. Finally, our work also provides a theoretical insight into the important observation by Rose and Brown [1991] (based on extensive experiments) that F _S =3 is often sufficient to provide high routability.

Due to recent advances in microfluidics, digital microfluidic biochips are expected to revolutionize laboratory procedures. One critical problem for biochip synthesis is the droplet routing problem. Unlike traditional very large scale integration routing problems, in addition to routing path selection, the biochip routing problem needs to address the issue of scheduling droplets under practical constraints imposed by the fluidic property and timing restriction of synthesis results. In this paper, we present the first network-flow-based routing algorithm that can concurrently route a set of noninterfering nets for the droplet routing problem on biochips. We adopt a two-stage technique of global routing followed by detailed routing. In global routing, we first identify a set of noninterfering nets and then adopt the network-flow approach to generate optimal global-routing paths for nets. In detailed routing, we present the first polynomial-time algorithm for simultaneous routing and scheduling using the global-routing paths with a negotiation-based routing scheme. Our algorithm targets at both the minimization of cells used for routing for better fault tolerance and minimization of droplet transportation time for better reliability and faster bioassay execution. Experimental results show the robustness and efficiency of our algorithm.

A wirelength-driven placer without considering routability could introduce irresolvable routing-congested placements. Therefore, it is desirable to develop an effective routability-driven placer for modern mixed-size designs employing hierarchical methodologies for faster turnaround time. In this paper, we propose a novel routability-driven analytical placement algorithm for hierarchical mixed-size circuit designs. This paper presents a novel design hierarchy identification technique to effectively identify design hierarchies and guide placement for better wirelength and routability. The proposed algorithm optimizes routability from four major aspects: 1) narrow channel handling; 2) pin density; 3) routing overflow optimization; and 4) net congestion optimization. Routability-driven legalization and detailed placement are also proposed to further optimize routing congestion. Compared with the participating teams for the 2012 ICCAD Design Hierarchy Aware Routability-driven Placement Contest, our placer can achieve the best quality (both the average overflow and wirelength) and the best overall score (by additionally considering running time).