Facilitated by microelectromechanical systems (MEMS) technology, MEMS speakers or microspeakers have been rapidly developed during the past decade to meet the requirements of the flourishing audio market. With advantages of a small footprint, low cost, and easy assembly, MEMS speakers are drawing extensive attention for potential applications in hearing instruments, portable electronics, and the Internet of Things (IoT). MEMS speakers based on different transduction mechanisms, including piezoelectric, electrodynamic, electrostatic, and thermoacoustic actuation, have been developed and significant progresses have been made in commercialization in the last few years. In this article, the principle and modeling of each MEMS speaker type is briefly introduced first. Then, the development of MEMS speakers is reviewed with key specifications of state-of-the-art MEMS speakers summarized. The advantages and challenges of all four types of MEMS speakers are compared and discussed. New approaches to improve sound pressure levels (SPLs) of MEMS speakers are also proposed. Finally, the remaining challenges and outlook of MEMS speakers are given.

Photoacoustic imaging (PAI) is drawing extensive attention and gaining rapid development as an emerging biomedical imaging technology because of its high spatial resolution, large imaging depth, and rich optical contrast. PAI has great potential applications in endoscopy, but the progress of endoscopic PAI was hindered by the challenges of manufacturing and assembling miniature imaging components. Over the last decade, microelectromechanical systems (MEMS) technology has greatly facilitated the development of photoacoustic endoscopes and extended the realm of applicability of the PAI. As the key component of photoacoustic endoscopes, micromachined ultrasound transducers (MUTs), including piezoelectric MUTs (pMUTs) and capacitive MUTs (cMUTs), have been developed and explored for endoscopic PAI applications. In this article, the recent progress of pMUTs (thickness extension mode and flexural vibration mode) and cMUTs are reviewed and discussed with their applications in endoscopic PAI. Current PAI endoscopes based on pMUTs and cMUTs are also introduced and compared. Finally, the remaining challenges and future directions of MEMS ultrasound transducers for endoscopic PAI applications are given.

Miniaturized ultrasonic transducer arrays with multiple frequencies are key components in endoscopic photoacoustic imaging (PAI) systems to achieve high spatial resolution and large imaging depth for biomedical applications. In this article, we report on the development of ceramic thin-film PZT-based dual- and multi-frequency piezoelectric micromachined ultrasonic transducer (pMUT) arrays and the demonstration of their PAI applications. With chips sized 3.5 mm in length or 10 mm in diameter, square and ring-shaped pMUT arrays incorporating as many as 2520 pMUT elements and multiple frequencies ranging from 1 MHz to 8 MHz were developed for endoscopic PAI applications. Thin ceramic PZT with a thickness of 9 μm was obtained by wafer bonding and chemical mechanical polishing (CMP) techniques and employed as the piezoelectric layer of the pMUT arrays, whose piezoelectric constant d₃₁ was measured to be as high as 140 pm/V. Benefiting from this high piezoelectric constant, the fabricated pMUT arrays exhibited high electromechanical coupling coefficients and large vibration displacements. In addition to electrical, mechanical, and acoustic characterization, PAI experiments with pencil leads embedded into an agar phantom were conducted with the fabricated dual- and multi-frequency pMUT arrays. Photoacoustic signals were successfully detected by pMUT elements with different frequencies and used to reconstruct single and fused photoacoustic images, which clearly demonstrated the advantages of using dual- and multi-frequency pMUT arrays to provide comprehensive photoacoustic images with high spatial resolution and large signal-to-noise ratio simultaneously.

In this paper, we present the design, fabrication, and characterization of a compact 4 × 4 piezoelectric micromachined ultrasonic transducer (pMUT) array and its application to photoacoustic imaging. The uniqueness of this pMUT array is the integration of a 4 μm-thick ceramic PZT, having significantly higher piezoelectric coefficient and lower stress than sol-gel or sputtered PZT. The fabricated pMUT array has a small chip size of only 1.8 × 1.6 mm ² with each pMUT element having a diameter of 210 μm. The fabricated device was characterized with electrical impedance measurement and acoustic sensing test. Photoacoustic imaging has also been successfully demonstrated on an agar phantom with a pencil lead embedded using the fabricated pMUT array.