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Dr. Xavier PERPIÑA

IMB-CNM (CSIC)

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Dr. Xavier Perpiñà (Almenar 1976) received the B.S. degree in physics, the M. Phil. Degree in electronic engineering, and the Ph.D. degree from the Universitat Autònoma de Barcelona, Barcelona, Spain, in 1999, 2002, and 2005, respectively. In 1999, he joined the Institut de Microelectrònica de Barcelona-Centro Nacional de Microelectrónica (IMB-CNM) of Spanish Research Council, Bellaterra, Spain. There, he began his research activity with the Power Devices and Systems Group until 2005. From 2005 to 2007, he was with Alstom Transport. Currently, he forms part of the permanent staff at IMB-CNM, as a scientific researcher. He has authored or coauthored more than 140 research papers published in international conference proceedings and journals, and has edited two books and holds 4 patents. He belongs to THERMINIC and EUROSIME conference scientific committees. His research interests include electrothermal characterization, reliability and layout robustness improvement in power devices, integrated circuits, and packaging for power applications

Research Keywords & Expertise

Electro-thermal charac...
Local electro-thermal ...
power devices-Design f...
Advanced instrumentati...
Power systems reliabil...

Fingerprints

5%
Electro-thermal characterization of ICs

Short Biography

Dr. Xavier Perpiñà (Almenar 1976) received the B.S. degree in physics, the M. Phil. Degree in electronic engineering, and the Ph.D. degree from the Universitat Autònoma de Barcelona, Barcelona, Spain, in 1999, 2002, and 2005, respectively. In 1999, he joined the Institut de Microelectrònica de Barcelona-Centro Nacional de Microelectrónica (IMB-CNM) of Spanish Research Council, Bellaterra, Spain. There, he began his research activity with the Power Devices and Systems Group until 2005. From 2005 to 2007, he was with Alstom Transport. Currently, he forms part of the permanent staff at IMB-CNM, as a scientific researcher. He has authored or coauthored more than 140 research papers published in international conference proceedings and journals, and has edited two books and holds 4 patents. He belongs to THERMINIC and EUROSIME conference scientific committees. His research interests include electrothermal characterization, reliability and layout robustness improvement in power devices, integrated circuits, and packaging for power applications