Google scholar: https://scholar.google.com/citations?view_op=list_works&hl=en&hl=en&user=jNChadgAAAAJ. PhD focused on: • Solder Joint Reliability and SMT Processes and Materials in Electronics Packaging area • Second level interconnect failure for Thermal, Drop/Shock • Damage & Failure Mechanisms. • Lean and Six Sigma, Process Optimizations, Process Development, Design Of Experiments Lead Reliability Engineer in semiconductor industry.