The Cu-1.7Ni-1.4Co-0.65Si (wt%) alloy is hot compressed by a Gleeble-1500D machine under a temperature range of 760 to 970 °C and a strain rate range of 0.01 to 10 s⁻¹. The flow stress increases with the extension of strain rate and decreases with the rising of deformation temperature. The dynamic recrystallization behavior happens during the hot compression deformation process. The hot deformation activation energy of the alloy can be calculated as 468.5 kJ/mol, and the high temperature deformation constitutive equation is confirmed. The hot processing map of the alloy is established on the basis of hot deformation behavior and hot working characteristics. With the optimal thermal deformation conditions of 940 to 970 °C and 0.01 to 10 s⁻¹, the fine equiaxed grain and no holes are found in the matrix, which can provide significant guidance for hot deformation processing technology of Cu–Ni–Co–Si alloy.

With the continuous integration of semiconductor devices, the requirements of the size accuracy and surface quality of etched lead frames are stricter. The etchant is a key factor in the etching process and etched surface quality, while the effects of the difference in etchants on the etched surface morphology of Cu alloy have not been directly studied. In this study, aqua regia, acidic FeCl₃ and two CuCl₂ solutions were used as etchants, and different CuCrSn specimens were etched and characterized. The results show that the etching rate in aqua regia is high, and the grain orientation, grain boundary (GB) and dislocations have significant influences on the local etching rate. The preferential etching of some atomic planes forms steps between the grains with different orientations, and preferential etching around the GB and dislocation group forms grooves, resulting in high surface roughness. For the surfaces etched by the FeCl₃ and CuCl₂ etchants, the steps and grooves are blurred; thus, they are less rough. The CuCrSn alloy surface etched by the aqua regia is clean, with little Cr-rich particles, while high-density Cr-rich particles remain on the surfaces etched by the FeCl₃ and CuCl₂ etchants. For the same kind of etchant, the ion concentration can affect the etching mechanism, rate and the etched surface morphology.

Thermal deformation behavior of Cu–Cr–Sn alloy ingots under deformation temperatures ranging from 600 °C to 950 °C and strain rates from 0.01 s⁻¹ to 10 s⁻¹ was investigated in detail. The thermal deformation constitutive equation and thermal processing map of the alloy were established, respectively. The activation energy Q was determined as 430.61 KJ/mol. The optimal deformation system corresponding to the hot working diagram was a deformation temperature of 900 °C and strain rate of 0.1 s⁻¹. Under these deformation conditions, twin dynamic recrystallization (TDRX), continuous dynamic recrystallization (CDRX), and discontinuous dynamic recrystallization (DDRX) occurred simultaneously, with the twinning process causing the stress–strain curve to exhibit a wavy change. The thermal deformation microstructure of the alloy is co-regulated by different recrystallization mechanisms, with DDRX occurring mainly at low deformation temperatures, and both CDRX and DDRX occurring at high deformation temperatures.

The CuCrSn alloy is promising as a high-strength and high-conductivity Cu alloy due to its relatively low smelting requirement. However, thus far investigations into the CuCrSn alloy are still quite lacking. In this study, the microstructure and properties of Cu-0.20Cr-0.25Sn (wt%) alloy specimens prepared under different rolling and aging combinations were comprehensively characterized, in order to reveal the effects of cold rolling and aging on properties of the CuCrSn. The results show that increasing the aging temperature from 400 °C to 450 °C can noticeably accelerate precipitation, and cold rolling before aging significantly increases its microhardness and promotes precipitation However, the deformation hardening is eliminated during the aging process, making the microhardness decrease monotonically when the aging temperature and the cold rolling ratio before aging are high. Performing cold rolling after aging can maximize precipitation strengthening and deformation strengthening, and the adverse impact on its conductivity is not serious. A tensile strength of 506.5 MPa and a conductivity of 70.33% IACS were obtained by such a treatment, whereas only the elongation decreases a little. Different strength-conductivity combinations of the CuCrSn alloy can be achieved through appropriate design of the aging and post-aging cold rolling conditions.

To obtain ultrahigh strength Cu alloy strip for board-to-board connectors, a CuNiSiMgMn multi-element high-solute alloy was designed, and high-temperature short-time solid solution was utilized to optimize the properties of this alloy. The evolution in microstructure and properties of the cold-rolled CuNiSiMgMn alloy strip during high-temperature short-time solid solution, aging, and further cold-rolling are investigated. The results reveal that there are high-density Ni_xSi precipitates and deformation defects in the original cold-rolled CuNiSiMgMn alloy strip. During a solid solution at 1000 °C, recrystallization primarily occurs between 15 and 30 s, while precipitate decomposition starts at a solid solution time of ~30 s and is almost complete 10 s later. With further increase in the solid solution time, the grain size of the alloy grows rapidly, but the residual precipitate particles exhibit little change. Upon aging at 500 °C for 2 h and a further 80% cold-rolling, nano-sized precipitates are formed, yielding high-strength alloy strips. The 80% cold-rolling increases the microhardness by 12% and decreases the electrical conductivity by 3% IACS. The strip solid solution-treated for 35 s exhibits the maximum strength, with a tensile strength of >950 MPa and a conductivity of >30% IACS. Further extension of the solid solution time decreases both the tensile strength and elongation. This work clarifies the critical time of recovery, recrystallization, and precipitate decomposition of the CuNiSiMgMn alloy during high-temperature solid solution and provides guidance for industrial production.

The CuCrSn alloy is promising as high-strength and high-conductivity Cu alloy due to its relative low smelting requirement, while thus far reports on the CuCrSn alloy is still quite lacked. In this study, the microstructure and properties of Cu-0.20Cr-0.25Sn (wt%) specimens prepared under different rolling and aging combinations were comprehensively characterized, in order to reveal the effects of cold rolling and aging on the CuCrSn alloy. The results show that increasing the aging temperature from 400 ºC to 450 ºC can obviously accelerates the precipitation, and the cold rolling before aging significantly increases the initial microhardness and promotes the precipitation. Whereas, the deformation hardening will be eliminated during the aging process, making the microhardness even decrease monotonically when the aging temperature and the rolling ratio before aging are high. Performing the cold rolling after the aging can maximize the effects of precipitation strengthening and deformation strengthening, and its adverse impact on the conductivity is not serious. A tensile strength of 506.5 MPa and a conductivity of 70.33% IACS were obtained with such a treatment, only the elongation decreases. Different strength-conductivity combinations of the CuCrSn alloy can be achieved through appropriate combinations of the aging and post aging cold rolling conditions.