The size (grain size and specimen size) effect makes traditional macroscopic forming technology unsuitable for a microscopic forming process. In order to investigate the size effect on mechanical properties and deformation behavior, pure copper wires (diameters range from 50 μm to 500 μm) were annealed at different temperatures to obtain different grain sizes. The results show that a decrease in wire diameter leads to a reduction in tensile strength, and this change is pronounced for large grains. The elongation of the material is in linear correlation to size factor D/d (diameter/grain size), i.e., at the same wire diameter, more grains in the section bring better plasticity. This phenomenon is in relationship with the ratio of free surface grains. A surface model combined with the theory of single crystal and polycrystal is established, based on the relationship between specimen/grain size and tensile property. The simulated results show that the flow stress in micro-scale is in the middle of the single crystal model (lower critical value) and the polycrystalline model (upper critical value). Moreover, the simulation results of the hybrid model calculations presented in this paper are in good agreement with the experimental results.

Cu-Ti alloys were strengthened by β’-Cu₄Ti metastable precipitation during aging. With the extension of the aging time, the β’-Cu₄Ti metastable phase transformed into the equilibrium β-Cu₄Ti phase. The Cu-3.5 wt% Ti(Cu-4.6 at% Ti) alloys with different processing were aged at different temperatures for various times after solution treatment at 880 °C for 1 h. The electrical conductivity of samples under different heat treatments had shown an upward trend as time increased during aging, but the hardness reached the peak value and then decreased. The hardness and electrical conductivity of the samples with 70% deformation after aging are higher tha n the samples without deformation. Deformation after aging would cause the metastable phase to dissolve into a matrix. The best combination value of conductivity and hardness is 13.88% IACS and 340.78 Hv, and the optimal heat treatment is 500 °C for 2 h + 70% deformation + 450 °C for 2 h.

The relationship between microstructure evolution and properties of a Cu-Cr-Sn alloy during aging and high-temperature softening was investigated in detail in the present work. The results show that the addition of Sn refines obviously the size of the Cr phase and enhances the thermal stability of the alloy, which improves the peak-aged hardness of the Cu-Cr-Sn alloy reaching 139 HV after aging at 450 °C for 240 min. In addition, the recrystallization behavior of the Cu-Cr alloy with the 0.12 wt.% of Sn at high temperature is also significantly inhibited. Lots of precipitated Cr phases and a high density of dislocations are found in the Cu-Cr-Sn alloy annealed at high temperature, resulting in the softening temperature of the Cu-Cr-Sn alloy reaching 565 °C, which is higher than (about 50 °C) that of the Cu-Cr alloy.

The Cu-1.7Ni-1.4Co-0.65Si (wt%) alloy is hot compressed by a Gleeble-1500D machine under a temperature range of 760 to 970 °C and a strain rate range of 0.01 to 10 s⁻¹. The flow stress increases with the extension of strain rate and decreases with the rising of deformation temperature. The dynamic recrystallization behavior happens during the hot compression deformation process. The hot deformation activation energy of the alloy can be calculated as 468.5 kJ/mol, and the high temperature deformation constitutive equation is confirmed. The hot processing map of the alloy is established on the basis of hot deformation behavior and hot working characteristics. With the optimal thermal deformation conditions of 940 to 970 °C and 0.01 to 10 s⁻¹, the fine equiaxed grain and no holes are found in the matrix, which can provide significant guidance for hot deformation processing technology of Cu–Ni–Co–Si alloy.

To study the effect of aluminum and nickel elements on the microstructures and properties of the nickel–aluminum bronze (NAB) alloy, four kinds of alloys with different compositions, ZCuAl7–7–4–2, ZCuAl8-6-4-2, ZCuAl9-5-4-2, and ZCuAl10-4-4-2, are prepared by vacuum-melting technology. The effects of different Al/Ni ratios on the microstructures of NAB are investigated using a metalloscope, scanning electron microscopy, transmission electron microscopy, and XPS analysis. The mechanical property is evaluated with microhardness testing and tensile mechanical testing. The corrosion resistance is evaluated using mass-loss testing, electrochemical testing, and corrosion-product characterization. The results show that with the increase of the Al/Ni ratio, the content of precipitated phases increases, while β′ and hard κ, which have a different morphology, appear. As the Al/Ni ratio rises from 1 to 2.5, the hardness increases from 104 HV to 202 HV, and the tensile strength increases by 394 MPa from 356 MPa to 751 MPa, but the elongation decreases substantially from 50.50% to 11.00%. The best corrosion resistance is shown on ZCuAl7-7-4-2, with a corrosion rate of 0.00267 mm/a after 30 d of static immersion corrosion in 3.5 wt.% NaCl solution. Through electrochemical testing and corrosion-product characterization, it is found that ZCuAl7-7-4-2 has the largest polarization resistance R_p, and the selective corrosion of the surface is mild.

Discontinuous precipitation-strengthened Cu-Ni-Si alloys are highly regarded for their combination of high strength and excellent electrical conductivity. However, the slow process of discontinuous precipitation, typically requiring up to 24 h for complete formation, significantly increases the alloy’s production costs and limits potential improvements in its properties. This study addresses this issue by applying pre-deformation to Cu-6Ni-1.42Si alloys, which accelerated the discontinuous precipitation (DP) of Ni₂Si by approximately 48 times, resulting in the formation of fast DP and full DP alloys. The fast DP alloy exhibited a smaller DP size and inter-distance than the full DP alloy, achieving a tensile strength of 1070 MPa and a conductivity of 38.5% IACS. In contrast, the full DP alloy had a slightly lower tensile strength (approximately 930 MPa) but a higher conductivity of 46% IACS. Both alloys outperform traditional Cu-Ni-Si alloys in strength while maintaining comparable conductivity. The accelerated DP technique improves mechanical properties without significantly sacrificing conductivity, offering a new approach for high-performance conductive materials.