Interface plays a decisive role in metal matrix composites, and the effects of Ti coating and W coating on the properties and microscopic mechanism of diamond-copper composites are compared in this paper. Ti-coated diamond with 50 nm, 100 nm and 150 nm plating thickness and W-coated diamond with 50 nm plating thickness are prepared by using magnetron sputtering. Then infiltration method is carried out to prepare diamond copper composites. SEM, EDS and XRD are used to material microstructure. Three-point bending experiment and flash method are used to test the bending strength and thermal conductivity of the composite material. The study found that, as the thickness of the Ti coating increases, the bending strength of the composites gradually increases, but the thermal conductivity first increases and then decreases. The thermal conductivity of W coated diamond copper composites is higher than that of Ti coated diamond copper composites with the same coating thickness. But bonding strength shows the opposite law. The reason for the above phenomenon is that the mechanism of action between the Ti coating and the W coating and the copper substrate is different at the micro interface of the composites. The research work has important reference value for the interface modification of diamond copper composites.

Paraffin wax (PW) has significant potential for spacecraft thermal management, but low thermal conductivity and leakage issues make it no longer sufficient for the requirements of evolving spacecraft thermal control systems. Although free-state expanded graphite (EG) as a thermal conductivity enhancer can ameliorate the above problems, it remains challenging to achieve higher thermal conductivity (K) (>8 W/(m·K)) at filler contents below 10 wt.% and to mitigate the leakage problem. Two preparations of thermally conductive shape-stabilized PW/EG composites, using the pressure-induced method and prefabricated skeleton method, were designed in this paper. The expanded graphite formed a nanoscale porous structure by different methods, which enhanced the capillary action between the graphite flake layers, improved the adsorption and encapsulation of EG, and alleviated the leakage problem. The thermal conductivity and the latent heat of the phase-change materials (PCM) prepared by the two methods mentioned above are 9.99 W/(m·K), 10.70 W/(m·K) and 240.06 J/g, 231.67 J/g, respectively, at EG loading by 10 wt.%, and the residual mass fraction was greater than 99% after 50 cycles of high and low temperature. In addition, due to the excellent thermal management capability of PW/EG, the operating temperature of electronic components can be stably maintained at 68–71 °C for about 15 min and the peak temperature can be reduced by at least 23 °C when the heating power of the electronic components is 10 w. These provide novel and cost-effective methods to further improve the management capability of spacecraft thermal control systems.

The use of a micro heat sink is an effective means of solving the problem of high-power chip heat dissipation. Diamond/Cu composites exhibit high thermal conductivity and a linear thermal expansion coefficient that is compatible with semiconductor materials, rendering them ideal micro heat sink materials. The aim of this study was to fabricate diamond/Cu and Cu separately as heat sinks and subject them to flow boiling heat transfer experiments. The results indicate that the diamond/Cu heat sink displayed a decrease in wall superheat of 10.2–14.5 °C and an improvement in heat transfer coefficient of 38–51% compared with the Cu heat sink under identical heat fluxes. The heat sink also exhibits enhanced thermal uniformity. Secondary diamond particles are incorporated into the gaps of the main diamonds, thereby constructing a three-dimensional heat conduction network within the composite material. The diamond network enhances the internal heat flux of the material while also creating more nucleation sites on the surface. These increase the boiling intensity of the diamond/Cu heat sink, leading to better heat transfer performance. By combining the transient thermal model with computational fluid dynamics, a heat transfer model based on the diamond/Cu heat sink is proposed. The efficient heat dissipation capability of diamond/Cu heat sinks can lower the working temperature of microelectronic devices, thereby improving device performance and reliability during operation.