Micro-electrical discharge machining (micro-EDM) is a good candidate for processing micro-hole arrays, which are critical features of micro-electro-mechanical systems (MEMS), diesel injector nozzles, inkjet printheads and turbine blades, etc. In this study, the wire vibration of the wire electro-discharge grinding (WEDG) system has been analyzed theoretically, and, accordingly, an improved WEDG method was developed to fabricate micron-scale diameter and high-aspect-ratio microelectrodes for the in-process micro-EDM of hole array with hole diameter smaller than 20 μm. The improved method has a new feature of a positioning device to address the wire vibration problem, and thus to enhance microelectrodes fabrication precision. Using this method, 14 μm diameter microelectrodes with less than 0.4 μm deviation and an aspect ratio of 142, which is the largest aspect ratio ever reported in the literature, were successfully fabricated. These microelectrodes were then used to in-process micro-EDM of hole array in stainless steel. The effects of applied voltage, current and pulse frequency on hole dimensional accuracy and microelectrode wear were investigated. The optimal processing parameters were selected using response–surface experiments. To improve machining accuracy, an in-process touch-measurement compensation strategy was applied to reduce the cumulative compensation error of the micro-EDM process. Using such a system, micro-hole array (2 × 80) with average entrance diameter 18.91 μm and average exit diameter 17.65 μm were produced in 50 μm thickness stainless steel sheets, and standard deviations of hole entrance and exit sides of 0.44 and 0.38 μm, respectively, were achieved.

This paper presents fabrication of complex surficial micro-features employing a cross-innovative hybrid process inspired from lithography and Jet-ECM. The process is referred here as mask electrolyte jet machining (MEJM). MEJM is a non-contact machining process which combines high resolution of lithography and greater flexibility of Jet-ECM. It is a non-contact process which can fabricate variety of microstructures on difficult-to-machine materials without need of expensive tooling. The presented work demonstrates the process performance of this technology by statistical analysis and multivariate kernel density estimation (KDE) based on probabilistic density function. Micro-letters are fabricated as an example of complex surficial structure comprising of multiple intersecting, straight and curved grooves. The processing response is characterized in terms of geometrical size, similarity ratio, and cumulative shape deviation. Experimental results demonstrated that micro letters with good repeatability (minimum SD of shape error ratio 0.297%) and shape accuracy (minimum shape error of 0.039%) can be fabricated with this technology. The results suggest MEJM could be a promising technology for batch manufacturing of surface microstructures with high productivity.

The consistency in the fabrication of microsurface structures on large workpieces remains a challenge for existing production techniques. Mask electrolyte jet machining (MEJM) is a hybrid mask-based electrochemical machining (ECM) process that combines the flexibility of Jet-ECM to flush the electrochemical by-products and the high throughput processing feature of through-mask electrochemical micromachining (TMEMM). In the present study, a duckbill-shaped nozzle is employed in the MEJM for the batch fabrication of microsurface structures which facilitates more uniform current density distribution over the entire machining area, resulting in better consistency. With a larger slit length, the duckbill nozzle will not only cover more processing area but also facilitates more uniform current density distribution over the entire machining area, resulting in a better consistency for batch fabrication. Thresholds of the ratio of slit length to the machining area were derived from a quantitative analysis, namely the efficient threshold and the performance threshold. The slit length of the duckbill nozzle should be at least twice as large as the machining area to wipe out any observable deviation on current density distribution in the machining area. An efficient and high-performance numerical simulation framework with a virtual gap concept is developed for the mask-based ECM processes to simulate microcavity profiles and associated current density distribution. The concept of a virtual gap is proposed to solve the simulation dilemma of elements being consumed in the mask-based ECM process. Quantitative analyses were carried out to study how the virtual gap influences the electric current density distribution in the interelectrode gap. A virtual gap smaller than 100 nm is recommended. Guidelines on how to ensure a smooth electric field transition across the coarse and fine-meshed zones are presented by conducting a quantitative analysis. As an example, this work has successfully fabricated several cavity arrays with different processing parameters. Both the experimental results and the numerical simulation frameworks are easy-to-implement and easy-to-extend for all the mask-based ECM processes.

A laser-induced cavitation bubble shock forming technology is proposed for microgroove formation in thin copper. It is stamped by using the impact pressure generated by the laser breakdown of liquid. The impact-induced micro-formation of thin copper is studied by numerical simulation and experimentation. A finite-element model is developed, and the impact pressure created by laser-induced cavitation is measured to study the spatial distribution of impact pressure. The laser-induced cavitation process of the high-speed impact on thin copper is numerically simulated. The results of simulations are consistent with those of experiments, confirming the model’s accuracy. The simulation is then used to study the dynamic formation and deformation behavior of the laser-induced cavitation impact of thin copper. The stress and thickness distributions during the formation of microgrooves in thin copper are also investigated. Furthermore, the influence of laser fluence and copper thickness on formation is studied. The results reveal that the high-speed impact forming of thin copper by laser-induced cavitation is due to three impact forces: a plasma shock wave, a cavitation shock wave, and a microjet, and this technology can be used to form thin metal walls.

The present work introduces a laser-induced cavitation bubble technique for forming an axisymmetric structure (i.e., microgroove) and the dynamics of a cavitation bubble from initial expansion to the collapse stages that were also simulated. Furthermore, the shock wave signals and dynamic properties of the cavitation bubble were recorded using a hydrophone and a high-speed camera. The experiments on microgrooves formed by laser-induced cavitation bubble stamping were carried out, and the effects of laser energy, the initial position of the bubble, and the number of impacts on the microformability of aluminum sheets are discussed. The depth of the microgroove was investigated using experiments, and it was found that the process can serve as a rapid technique for impressing microfeatures on thin-sheet metals. The experimental results showed that as the initial position of the bubble increased, the deformation depth decreased. As the laser energy and number of impacts increased, the deformation depth increased. The results of the response surface experiments showed that a laser energy of 27 mJ, 3 impacts, and a bubble position of 3 mm were optimal for the process. By using the optimal parameters, flat and smooth microgrooves with a forming depth of 102.54 µm were successfully fabricated. Furthermore, the maximum thickness thinning of the microgroove section occurred at the entrance areas, and this area had the greatest hardness. This also indicated that the greatest amount of plastic deformation of the material and grain refinement occurred in this area. On the other hand, the aluminum foil did not undergo oxidation during the plastic deformation process. These results demonstrated that laser-induced bubble stamping is an advanced micromachining method with promising applications.