A high-efficiency three-dimensionally (3-D) shaped polymer multi-jet impingement cooler based on cost-efficient fabrication techniques is introduced for the cooling of high-power applications. State-of-the-art highly efficient multi-jet cooling solutions rely on expensive Si or ceramic fabrication techniques, while low-cost cooling solutions have been proposed for less performant single-jet impingement. In this paper, we present the concept, modeling, design, fabrication, experimental characterization, and benchmarking with literature data of a multi-jet impingement based liquid cooling solution, fabricated using low-cost polymer fabrication techniques, targeted to directly cool the backside of high-power devices. For the modeling study, unit cell model and full system level models are used to study the nozzle array scaling trends and thermal and fluidic jet-to-jet interactions. Furthermore, design guidelines for high-power electronics cooling are provided, including geometry selections, material selection, and fabrication techniques. Based on the design guidelines and cooling concept, this paper demonstrates a 3-D-shaped polymer impingement cooler with a 4 × 4 nozzle array, showing a very good thermal performance with low required pumping power. The multi-jet cooler can achieve heat transfer coefficients up to 6.25 × 10 ⁴ W/m ² ·K with a pump power as low as 0.3 W. The benchmarking study confirms furthermore that multi-jet cooling is more efficient than single-jet cooling and that direct cooling on the backside of the semiconductor device is more efficient than cooling the substrate or base plate.