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DC nanogrid architectures with Photovoltaic (PV) modules are expected to grow significantly in the next decades. Therefore, the integration of multi-port power converters and high-frequency isolation links are of increasing interest. The Triple Active Bridge (TAB) topology shows interesting advantages in terms of isolation, Zero Voltage Switching (ZVS) over wide load and input voltage ranges and high frequency operation capability. Thus, controlling PV modules is not an easy task due to the complexity and control stability of the system. In fact, the TAB power transfer function has many degrees of freedom, and the relationship between any of two ports is always dependent on the third one. In this paper we analyze the interfacing of photovoltaic arrays to the TAB with different solar conditions. A simple but effective control solution is proposed, which can be implemented through general purpose microcontrollers. The TAB is applied to an islanded DC nanogrid, which can be useful and readily implemented in locations where the utility grid is not available or reliable, and applications where isolation is required as for example More Electric Aircraft (MEA). Different conditions have been simulated and the control loops are proved for a reliable bus voltage control on the load side and a good maximum power point tracking (MPPT).
Danilo Santoro; Iñigo Kortabarria; Andrea Toscani; Carlo Concari; Paolo Cova; Nicola Delmonte. PV Modules Interfacing Isolated Triple Active Bridge for Nanogrid Applications. Energies 2021, 14, 2854 .
AMA StyleDanilo Santoro, Iñigo Kortabarria, Andrea Toscani, Carlo Concari, Paolo Cova, Nicola Delmonte. PV Modules Interfacing Isolated Triple Active Bridge for Nanogrid Applications. Energies. 2021; 14 (10):2854.
Chicago/Turabian StyleDanilo Santoro; Iñigo Kortabarria; Andrea Toscani; Carlo Concari; Paolo Cova; Nicola Delmonte. 2021. "PV Modules Interfacing Isolated Triple Active Bridge for Nanogrid Applications." Energies 14, no. 10: 2854.
In this work we propose a procedure based on finite element simulations to compute a lumped-parameter thermal model of capacitors. The extracted Foster or Cauer network coupled to the electrical model can be useful to evaluate the temperature of capacitors in circuit simulators as SPICE or Simulink. In this way, it is possible to evaluate the expected maximum operative temperature of the capacitor embedded in a circuit before its real application, avoiding unexpected failures since the prototyping stage. Here, we describe the workflow of the method and, finally, the proposed approach will be used for designing snubber capacitors for medium power (60 kW) high frequency AC/AC converter.
N. Delmonte; D. Cabezuelo; I. Kortabarria; D. Santoro; A. Toscani; P. Cova. A method to extract lumped thermal networks of capacitors for reliability oriented design. Microelectronics Reliability 2020, 114, 113737 .
AMA StyleN. Delmonte, D. Cabezuelo, I. Kortabarria, D. Santoro, A. Toscani, P. Cova. A method to extract lumped thermal networks of capacitors for reliability oriented design. Microelectronics Reliability. 2020; 114 ():113737.
Chicago/Turabian StyleN. Delmonte; D. Cabezuelo; I. Kortabarria; D. Santoro; A. Toscani; P. Cova. 2020. "A method to extract lumped thermal networks of capacitors for reliability oriented design." Microelectronics Reliability 114, no. : 113737.
The aim of this work is to show that a significant increase of the efficiency of a Wave Energy Converter (WEC) can be achieved already at an early design stage, through the choice of a turbine and control regulation, by means of an accurate Wave-to-Wire (W2W) modeling that couples the hydrodynamic response calibrated in a wave flume to a Hardware-In-the-Loop (HIL) test bench with sizes and rates not matching those of the system under development. Information on this procedure is relevant to save time, because the acquisition, the installation, and the setup of a test rig are not quick and easy. Moreover, power electronics and electric machines to emulate turbines and electric generators matching the real systems are not low-cost equipment. The use of HIL is important in the development of WECs also because it allows the carrying out of tests in a controlled environment, and this is again time- and money-saving if compared to tests done on a real system installed at the sea. Furthermore, W2W modeling can be applied to several Power Take-Off (PTO) configurations to experiment different control strategies. The method here proposed, concerning a specific HIL for testing power electronics and control laws for a specific WECs, may have a more general validity.
Nicola Delmonte; Eider Robles; Paolo Cova; Francesco Giuliani; François Xavier Faÿ; Joseba Lopez; Piero Ruol; Luca Martinelli. An Iterative Refining Approach to Design the Control of Wave Energy Converters with Numerical Modeling and Scaled HIL Testing. Energies 2020, 13, 2508 .
AMA StyleNicola Delmonte, Eider Robles, Paolo Cova, Francesco Giuliani, François Xavier Faÿ, Joseba Lopez, Piero Ruol, Luca Martinelli. An Iterative Refining Approach to Design the Control of Wave Energy Converters with Numerical Modeling and Scaled HIL Testing. Energies. 2020; 13 (10):2508.
Chicago/Turabian StyleNicola Delmonte; Eider Robles; Paolo Cova; Francesco Giuliani; François Xavier Faÿ; Joseba Lopez; Piero Ruol; Luca Martinelli. 2020. "An Iterative Refining Approach to Design the Control of Wave Energy Converters with Numerical Modeling and Scaled HIL Testing." Energies 13, no. 10: 2508.
This work deals with optimization of boards with commercial discrete power GaN FETs in applications where natural air convection is a strict constraint. In these cases, both thermal and electromagnetic behaviours are critical reliability issues for the board design, and they are modeled by Finite Element (FE) analysis, starting from literature description of the device structure, and measurements on a simple test circuit. For improved accuracy and more realistic modeling, verification and validation simulation steps are introduced, in order to evaluate the relevant error parameters for different FEM solutions. The results obtained demonstrate a good fitting with experimental and make it possible to improve board thermal characteristic. The electromagnetic simulations allow the evaluation, and possibly the reduction, of parasitic inductances for different layouts. Then, the proposed approach enables thermal and electromagnetic optimization of the layout design by simple FEM simulations, without any preliminary prototype, with time and cost saving.
P. Cova; N. Delmonte; Danilo Santoro. Power GaN FET boards thermal and electromagnetic optimization by FE modeling. Microelectronics Reliability 2019, 100-101, 113466 .
AMA StyleP. Cova, N. Delmonte, Danilo Santoro. Power GaN FET boards thermal and electromagnetic optimization by FE modeling. Microelectronics Reliability. 2019; 100-101 ():113466.
Chicago/Turabian StyleP. Cova; N. Delmonte; Danilo Santoro. 2019. "Power GaN FET boards thermal and electromagnetic optimization by FE modeling." Microelectronics Reliability 100-101, no. : 113466.
Current environmental concerns and fuel scarcity are leading to the progressive introduction of Electric Vehicles (EV) in the global fleet vehicle population. This requires significant design and research efforts from scientific community and industry to provide reliable automotive electric propulsion systems. The power modules used for automotive traction inverters can be considered as central elements of such systems. As they are subject to high electro-thermal stress during operation, Design-for-Reliability (DfR) approaches should be adopted. Thus, accurate models for electro-thermal simulations are relevant since the early design stages. However, such simulations become highly time consuming and complex when accurate thermal characterization through standardized or real driving conditions needs to be provided. In this context, this work proposes a simulation methodology that combines real-time simulation for electro-thermal characterization of the whole EV propulsion system, using a 1D equivalent thermal impedance circuit, in conjunction with 3D FEM thermal simulation. In this way, an accurate thermal characterization of the power module under driving cycles with long duration (of hundreds of seconds) can be obtained without computing heavy 3D FEM simulations. The proposed procedure allows to simplify and speed up the early design stages while maintaining high accuracy in the results.
A. Matallana; E. Robles; E. Ibarra; J. Andreu; N. Delmonte; P. Cova. A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles. Microelectronics Reliability 2019, 102, 113500 .
AMA StyleA. Matallana, E. Robles, E. Ibarra, J. Andreu, N. Delmonte, P. Cova. A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles. Microelectronics Reliability. 2019; 102 ():113500.
Chicago/Turabian StyleA. Matallana; E. Robles; E. Ibarra; J. Andreu; N. Delmonte; P. Cova. 2019. "A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles." Microelectronics Reliability 102, no. : 113500.
The design of an innovative converter for ohmic heating of fluid foods is presented. Application-specific requirements are addressed with new solutions and verified on a commercial-size 60 kW prototype. A multi-output high-voltage (0.8 to 4 kV) transformer with automatic tap change enriches a basic H-bridge topology, enabling processing of a wide set of foods and allowing grounding one of the outputs. High power density is achieved by power switches Pareto optimization in the reliability-efficiency objectives and by pushing the switching frequency up to 30 kHz, solving the electrode corrosion problem, too. Reproducible and reliable operation is assured by three different control strategies: load variability is dealt with a high-dynamics power control, repeatable output is guaranteed by input voltage compensation, optimal working point is ensured by control of the transformer primary current DC component. This last control allows also removing the output capacitors, improving density metrics with respect to the state-of-the-art. Analytical models for all control strategies are given to support dynamic performance tuning while guaranteeing stability.
Alessandro Soldati; Andrea Toscani; Paolo Cova; Giovanni Franceschini. Design and Control of High-Density High-Voltage Smart Converter for Food Ohmic Heating. IEEE Transactions on Industry Applications 2019, 55, 7712 -7725.
AMA StyleAlessandro Soldati, Andrea Toscani, Paolo Cova, Giovanni Franceschini. Design and Control of High-Density High-Voltage Smart Converter for Food Ohmic Heating. IEEE Transactions on Industry Applications. 2019; 55 (6):7712-7725.
Chicago/Turabian StyleAlessandro Soldati; Andrea Toscani; Paolo Cova; Giovanni Franceschini. 2019. "Design and Control of High-Density High-Voltage Smart Converter for Food Ohmic Heating." IEEE Transactions on Industry Applications 55, no. 6: 7712-7725.
Junction temperature monitoring for power devices is an essential requirement for high-reliability applications. Temperature sensitive electrical parameters (TSEPs) are powerful tools in this process, but to achieve sufficient accuracy they require complex characterization procedures for each part, that can hardly be implemented in mass-produced converters. This work proposes a combination of interdisciplinary approaches to ultimately solve this problem for power MOSFETs by an automated procedure that can occur in-place, with devices mounted and without any specific user intervention nor additional heating components. The TSEP exploited in this work is the on-state drain-source voltage of the power MOSFET. A wide-bandwidth on-state voltage sensing circuit and a low-cost thermistor conditioning circuit to sense the case temperature of the device are presented and modeled. A lumped parameters thermal model of the system is given and FEM simulations are employed to obtain first-guess values for the unknown thermal network parameters, integrating information from the device datasheet. Finally, an observer based on the Kalman filter applied to the data collected from these sources is presented and evaluated experimentally. Performance is assessed with the use of thermal imaging techniques.
Alessandro Soldati; Nicola Delmonte; Paolo Cova; Carlo Concari. Device-Sensor Assembly FEA Modeling to Support Kalman-Filter-Based Junction Temperature Monitoring. IEEE Journal of Emerging and Selected Topics in Power Electronics 2019, 7, 1736 -1747.
AMA StyleAlessandro Soldati, Nicola Delmonte, Paolo Cova, Carlo Concari. Device-Sensor Assembly FEA Modeling to Support Kalman-Filter-Based Junction Temperature Monitoring. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2019; 7 (3):1736-1747.
Chicago/Turabian StyleAlessandro Soldati; Nicola Delmonte; Paolo Cova; Carlo Concari. 2019. "Device-Sensor Assembly FEA Modeling to Support Kalman-Filter-Based Junction Temperature Monitoring." IEEE Journal of Emerging and Selected Topics in Power Electronics 7, no. 3: 1736-1747.
Graphene conductive foams have shown very high potential as cooling material in electronic systems. Its exploitation with discrete GaN transistors is demonstrated in this paper. A proper experimental setup is developed to extract the high temperature thermal performance of this material at different test conditions. The results are very promising, showing a noticeable reduction of the device maximum temperature, especially at high dissipated power densities. Moreover, experimental results allowed the validation of a 3D finite element model of the assembled device, which can be used for thermal layout optimization. Finally, preliminary stress tests are in progress, to evaluate the stability of electrical and thermal performance of the proposed graphene based assembly. Good stability was obtained, both at low and high ambient temperatures.
M. Antonini; P. Cova; N. Delmonte; Alberto Castellazzi. GaN transistors efficient cooling by graphene foam. Microelectronics Reliability 2018, 88-90, 812 -816.
AMA StyleM. Antonini, P. Cova, N. Delmonte, Alberto Castellazzi. GaN transistors efficient cooling by graphene foam. Microelectronics Reliability. 2018; 88-90 ():812-816.
Chicago/Turabian StyleM. Antonini; P. Cova; N. Delmonte; Alberto Castellazzi. 2018. "GaN transistors efficient cooling by graphene foam." Microelectronics Reliability 88-90, no. : 812-816.
This work proposes a SPICE-CFD/FEM based methodology for an optimized design of water heatsinks for high power electronic converters. Cold plates are a key issue for power electronics systems, in order to obtain reliable applications. Often the design of custom heatsinks is done by manual procedures, which require the fabrication of several prototypes. On the other hand, CFD + FEM analysis is a powerful tool to design optimized cold plates, but it requires skilled technicians and long simulation studies. In this paper a SPICE based methodology, with negligible simulation cost and limited use of CFD + FEM simulations and prototypes, is demonstrated to be adequate to design cold plates with the lowest thermal resistance and the lowest surface temperature gradient. A prototype made with the proposed methodology was used to validate the approach. Results show a good agreement between cold plate thermal-fluid dynamic 3D numerical simulations and the SPICE based methodology. A software tool was developed to easily exploit the proposed methodology in customized design of cold plates for any specific application, and to extract necessary data for the datasheet: pressure drop, and thermal resistance.
P. Cova; N. Delmonte; Diego Chiozzi; M. Portesine; F. Vaccaro; E. Mantegazza. Water cold plates for high power converters: A software tool for easy optimized design. Microelectronics Reliability 2018, 88-90, 801 -805.
AMA StyleP. Cova, N. Delmonte, Diego Chiozzi, M. Portesine, F. Vaccaro, E. Mantegazza. Water cold plates for high power converters: A software tool for easy optimized design. Microelectronics Reliability. 2018; 88-90 ():801-805.
Chicago/Turabian StyleP. Cova; N. Delmonte; Diego Chiozzi; M. Portesine; F. Vaccaro; E. Mantegazza. 2018. "Water cold plates for high power converters: A software tool for easy optimized design." Microelectronics Reliability 88-90, no. : 801-805.
Mauro Ciappa; Paolo Cova; Gaudenzio Meneghesso; Francesco Iannuzzo. Editorial. Microelectronics Reliability 2018, 88-90, 1 .
AMA StyleMauro Ciappa, Paolo Cova, Gaudenzio Meneghesso, Francesco Iannuzzo. Editorial. Microelectronics Reliability. 2018; 88-90 ():1.
Chicago/Turabian StyleMauro Ciappa; Paolo Cova; Gaudenzio Meneghesso; Francesco Iannuzzo. 2018. "Editorial." Microelectronics Reliability 88-90, no. : 1.
This paper presents a comparison of conventional single-phase water/glycol liquid and innovative two-phase cooling technology for thermal management of high power electronics automotive IGBT modules during full drive cycle. The proposed two-phase cooling system is built using conventional automotive air conditioning components (condenser, expansion valve, compressor, and vapor and liquid lines) and conventional cold plate as used for single-phase cooling, thus the design does not require the development of new technology for its implementation. 3-D numerical simulation in COMSOL and experimental results of two-phase cooling have been obtained on a prototype and compared to conventional water/glycol cooling high power electronics modules, with considerable improvement on working temperature, power transfer capacity and equalization of die temperatures during a full driving cycle. These results suggest that two-phase cooling using the same cold plates as in single-phase cooling can be used to substantially improve the performance and reliability, of EV power converters without major changes.
Itxaso Aranzabal; Inigo Martinez De Alegria; Nicola Delmonte; Paolo Cova; Inigo Kortabarria. Comparison of the Heat Transfer Capabilities of Conventional Single- and Two-Phase Cooling Systems for an Electric Vehicle IGBT Power Module. IEEE Transactions on Power Electronics 2018, 34, 4185 -4194.
AMA StyleItxaso Aranzabal, Inigo Martinez De Alegria, Nicola Delmonte, Paolo Cova, Inigo Kortabarria. Comparison of the Heat Transfer Capabilities of Conventional Single- and Two-Phase Cooling Systems for an Electric Vehicle IGBT Power Module. IEEE Transactions on Power Electronics. 2018; 34 (5):4185-4194.
Chicago/Turabian StyleItxaso Aranzabal; Inigo Martinez De Alegria; Nicola Delmonte; Paolo Cova; Inigo Kortabarria. 2018. "Comparison of the Heat Transfer Capabilities of Conventional Single- and Two-Phase Cooling Systems for an Electric Vehicle IGBT Power Module." IEEE Transactions on Power Electronics 34, no. 5: 4185-4194.
An innovative modelling methodology for the simulation of electro-thermal interaction in power devices, based on Neural Networks (NNs), is shown. The suitability of NNs in modelling the complicated non-linear, temperature dependent characteristic that power electronics devices feature, is shown. The proposed methodology is particularly suited to be implemented in electrical simulators. The approach can be divided in two parallel steps: firstly, NNs are used to describe the complex, highly non-linear electro-thermal characteristic of the considered device; secondly, a non-linear RC-based thermal model is generated, with a method published in a previous work. These two sub-systems are coupled together in order to achieve a self-consistent electro-thermal model. The modelling results are validated against experiments with very satisfactory results. The technique is explained in detail; advantages and drawbacks of the method are then discussed.
Diego Chiozzi; Mirko Bernardoni; Nicola Delmonte; Paolo Cova. A Neural Network Based Approach to Simulate Electrothermal Device Interaction in SPICE Environment. IEEE Transactions on Power Electronics 2018, 34, 4703 -4710.
AMA StyleDiego Chiozzi, Mirko Bernardoni, Nicola Delmonte, Paolo Cova. A Neural Network Based Approach to Simulate Electrothermal Device Interaction in SPICE Environment. IEEE Transactions on Power Electronics. 2018; 34 (5):4703-4710.
Chicago/Turabian StyleDiego Chiozzi; Mirko Bernardoni; Nicola Delmonte; Paolo Cova. 2018. "A Neural Network Based Approach to Simulate Electrothermal Device Interaction in SPICE Environment." IEEE Transactions on Power Electronics 34, no. 5: 4703-4710.
In this work, a general methodology to extract compact, non-linear transient thermal models of complex thermal systems is presented and validated. The focus of the work is to show a robust method to develop compact and accurate non-linear thermal models in the general case of systems with multiple heat sources. A real example of such a system is manufactured and its thermal behaviour is analyzed by means of Infra-Red thermography measurements. A transient, non-linear Finite-Element-Method based model is therefore built and tuned on the measured thermal responses. From this model, the transient thermal responses of the system are calculated in the locations of interest. From these transient responses, non-linear compact transient thermal models are derived. These models are based on Foster network topology and they can capture the effect of thermal non-linearities present in any real thermal system, accounting for mutual interaction between different power sources. The followed methodology is described, verification of the model against measurements is performed and limitations of the approach are therefore discussed. The developed methodology shows that it is possible to capture strongly non-linear effects in multiple-heat source systems with very good accuracy, enabling fast and accurate thermal simulations in electrical solvers.
Mirko Bernardoni; Nicola Delmonte; Diego Chiozzi; Paolo Cova. Non-linear thermal simulation at system level: Compact modelling and experimental validation. Microelectronics Reliability 2018, 80, 223 -229.
AMA StyleMirko Bernardoni, Nicola Delmonte, Diego Chiozzi, Paolo Cova. Non-linear thermal simulation at system level: Compact modelling and experimental validation. Microelectronics Reliability. 2018; 80 ():223-229.
Chicago/Turabian StyleMirko Bernardoni; Nicola Delmonte; Diego Chiozzi; Paolo Cova. 2018. "Non-linear thermal simulation at system level: Compact modelling and experimental validation." Microelectronics Reliability 80, no. : 223-229.
Fausto Fantini; Giancarlo Salviati; Mattia Borgarino; Laura Cattani; Paolo Cova; Laura Lazzarini; Carlo Zanotti Fregonara. Degradation mechanisms in heterostructure devices and their correlation with defects. Defect Recognition and Image Processing in Semiconductors 1997 2017, 503 -514.
AMA StyleFausto Fantini, Giancarlo Salviati, Mattia Borgarino, Laura Cattani, Paolo Cova, Laura Lazzarini, Carlo Zanotti Fregonara. Degradation mechanisms in heterostructure devices and their correlation with defects. Defect Recognition and Image Processing in Semiconductors 1997. 2017; ():503-514.
Chicago/Turabian StyleFausto Fantini; Giancarlo Salviati; Mattia Borgarino; Laura Cattani; Paolo Cova; Laura Lazzarini; Carlo Zanotti Fregonara. 2017. "Degradation mechanisms in heterostructure devices and their correlation with defects." Defect Recognition and Image Processing in Semiconductors 1997 , no. : 503-514.
A high performance parallelable 2 MVA, 50/60 Hz AC/AC frequency converter for harbor applications was designed and built. A specific comprehensive digital control system was set up, in order to obtain optimal current sharing among two or more parallel power converters. The control, based on a master-slave strategy, also guarantees good system availability in case of faults, even when the master is affected, by switching off the faulty converter and assuring continuous system operation under power derating. The control system was designed using MATLAB/ Simulink/PLECS tools, and tested with reduced-scale prototypes. After fine tuning a good agreement between prototype measurements and simulations was obtained. The full-size system, composed of two 2 MVA converters, was then fabricated and tested, demonstrating performances compliant with the requirements and aligned with simulations and measurements performed on the prototypes.
Paolo Cova; Andrea Toscani; Carlo Concari; Giovanni Franceschini; Marco Portesine. Comprehensive Control System for Parallelable 60 Hz-2MVA Harbor AC/AC Converters. IEEE Transactions on Industrial Informatics 2017, 14, 2432 -2441.
AMA StylePaolo Cova, Andrea Toscani, Carlo Concari, Giovanni Franceschini, Marco Portesine. Comprehensive Control System for Parallelable 60 Hz-2MVA Harbor AC/AC Converters. IEEE Transactions on Industrial Informatics. 2017; 14 (6):2432-2441.
Chicago/Turabian StylePaolo Cova; Andrea Toscani; Carlo Concari; Giovanni Franceschini; Marco Portesine. 2017. "Comprehensive Control System for Parallelable 60 Hz-2MVA Harbor AC/AC Converters." IEEE Transactions on Industrial Informatics 14, no. 6: 2432-2441.
The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization
P. Cova; A.M. Aliyu; A. Castellazzi; D. Chiozzi; N. Delmonte; P. Lasserre; N. Pignoloni. Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. Microelectronics Reliability 2017, 76-77, 277 -281.
AMA StyleP. Cova, A.M. Aliyu, A. Castellazzi, D. Chiozzi, N. Delmonte, P. Lasserre, N. Pignoloni. Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. Microelectronics Reliability. 2017; 76-77 ():277-281.
Chicago/Turabian StyleP. Cova; A.M. Aliyu; A. Castellazzi; D. Chiozzi; N. Delmonte; P. Lasserre; N. Pignoloni. 2017. "Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch." Microelectronics Reliability 76-77, no. : 277-281.
An alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes is presented. This flat switch, which is designed for high-frequency application with high power density, exhibits high strength, high toughness, low parasitic inductance and high thermal conductivity. Such a novel assembly approach is suitable to optimize performance, reliability and availability of the power system in which it is used. The paper focuses on the thermal performance of this assembly at normal and extreme operating conditions, studied by means of FEM thermo-fluidynamic simulations of the module integrated with connectors and liquid cooler, and thermal measurement performed on an early prototype. Improved solutions are also investigated by the FE model
P. Cova; N. Delmonte; A.K. Solomon; A. Castellazzi. Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability. Microelectronics Reliability 2016, 64, 507 -512.
AMA StyleP. Cova, N. Delmonte, A.K. Solomon, A. Castellazzi. Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability. Microelectronics Reliability. 2016; 64 ():507-512.
Chicago/Turabian StyleP. Cova; N. Delmonte; A.K. Solomon; A. Castellazzi. 2016. "Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability." Microelectronics Reliability 64, no. : 507-512.
D. Chiozzi; M. Bernardoni; N. Delmonte; Paolo Cova. A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies. Microelectronics Reliability 2016, 58, 126 -132.
AMA StyleD. Chiozzi, M. Bernardoni, N. Delmonte, Paolo Cova. A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies. Microelectronics Reliability. 2016; 58 ():126-132.
Chicago/Turabian StyleD. Chiozzi; M. Bernardoni; N. Delmonte; Paolo Cova. 2016. "A simple 1-D finite elements approach to model the effect of PCB in electronic assemblies." Microelectronics Reliability 58, no. : 126-132.
The reliability of a power converter can be improved using a well-dimensioned cold plate. For this purpose, it is necessary to realize a state-of-the-art cold plate by means of thermal-fluid dynamic numerical analysis and an ad hoc experimental test bench. Features and metrological characterization of a test bench for cold plate characterization are discussed in this paper. An infrared camera is used to measure the outer surfaces, and thermocouples are employed to measure the temperatures of some inner points, but not all the points of a structure under test are accessible to probes and sensing. An accurate 3-D numerical model has been set to widen the cold plate characterization investigating the values of the variables of interest, such as the temperature and the water velocity field, in all the points of the geometry. A case study is described, showing that using modeling with potentially high accuracy in designing new systems can be useful not only to choose, by comparison, the best solution, saving time and prototyping costs, but also to foresee the system performance.
Massimo Lazzaroni; Mauro Citterio; Stefano Latorre; Agostino Lanza; Paolo Cova; Nicola Delmonte; Francesco Giuliani. Metrological Characterization of Cold Plates for Power Converters. IEEE Transactions on Instrumentation and Measurement 2015, 65, 37 -45.
AMA StyleMassimo Lazzaroni, Mauro Citterio, Stefano Latorre, Agostino Lanza, Paolo Cova, Nicola Delmonte, Francesco Giuliani. Metrological Characterization of Cold Plates for Power Converters. IEEE Transactions on Instrumentation and Measurement. 2015; 65 (1):37-45.
Chicago/Turabian StyleMassimo Lazzaroni; Mauro Citterio; Stefano Latorre; Agostino Lanza; Paolo Cova; Nicola Delmonte; Francesco Giuliani. 2015. "Metrological Characterization of Cold Plates for Power Converters." IEEE Transactions on Instrumentation and Measurement 65, no. 1: 37-45.
Ocean waves are a huge largely unexploited energy resource, and the potential for extracting energy from waves is great. Research in this area is driven by the need to meet renewable-energy targets, but it is relatively immature compared to other renewable-energy technologies. This review introduces some device types that represent the state of the art of oscillating water column technology, a kind of wave energy converter (WEC). Unlike other works in literature, typically limited to specific aspects of WECs, in this paper, a system-wide perspective will be pursued, from the sea waves to the grid connection.
Nicola Delmonte; Davide Barater; Francesco Giuliani; Paolo Cova; Giampaolo Buticchi. Review of Oscillating Water Column Converters. IEEE Transactions on Industry Applications 2015, 52, 1 -1.
AMA StyleNicola Delmonte, Davide Barater, Francesco Giuliani, Paolo Cova, Giampaolo Buticchi. Review of Oscillating Water Column Converters. IEEE Transactions on Industry Applications. 2015; 52 (2):1-1.
Chicago/Turabian StyleNicola Delmonte; Davide Barater; Francesco Giuliani; Paolo Cova; Giampaolo Buticchi. 2015. "Review of Oscillating Water Column Converters." IEEE Transactions on Industry Applications 52, no. 2: 1-1.