Shalini Singh

Dr. Shalini Singh

orcid

Research Focus & Metrics

Academic Career Length

16Years (2011-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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27 July 2021 in Materials
Verified
Journal Article
Open access
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SSShalini Singh
Shalini Singh
Jinoop Arackal NarayananJinoop Arackal Narayanan
Jinoop Arackal Narayanan
GORLEA THRINADH ANANTHVENKATA TARUNKUMARGORLEA THRINADH ANANTHVENKATA TARUNKUMAR
GORLEA THRINADH ANANTHVENKATA TARUNKUMAR
PIPalani I.A.
Palani I.A.
CPChrist Prakash Paul
Christ Prakash Paul
Prashanth Konda GokuldossPrashanth Konda Gokuldoss
Prashanth Konda Gokuldoss
Wire arc additive manufacturing is a metal additive manufacturing technique that allows the fabrication of large size components at a high deposition rate. During wire arc additive manufacturing, multi-layer deposition results in heat accumulation, which raises the preheat temperature of the previously built layer. This causes process instabilities, resulting in deviations from the desired dimensions and variations in material properties. In the present study, a systematic investigation is carried out by varying the interlayer delay from 20 to 80 s during wire arc additive manufacturing deposition of the wall structure. The effect of the interlayer delay on the density, geometry, microstructure and mechanical properties is investigated. An improvement in density, reduction in wall width and wall height and grain refinement are observed with an increase in the interlayer delay. The grain refinement results in an improvement in the micro-hardness and compression strength of the wall structure. In order to understand the effect of interlayer delay on the temperature distribution, numerical simulation is carried out and it is observed that the preheat temperature reduced with an increase in interlayer delay resulting in variation in geometry, microstructure and mechanical properties. The study paves the direction for tailoring the properties of wire arc additive manufacturing-built wall structures by controlling the interlayer delay period.

1 June 2021 in Journal of Manufacturing Processes
Verified
Journal Article
Closed access
SSShalini Singh
Shalini Singh
NRN. Resnina
N. Resnina
SBS. Belyaev
S. Belyaev
AJA.N. Jinoop
A.N. Jinoop
ASAshish Shukla
Ashish Shukla
KBK.S. Bindra
K.S. Bindra

1 December 2021 in Materialia
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Journal Article
Closed access
NRN. Resnina
N. Resnina
IPI.A. Palani
I.A. Palani
SBS. Belyaev
S. Belyaev
SSShalini Singh
Shalini Singh
PLP. Liulchak
P. Liulchak
EDE. Demidova
E. Demidova


17 February 2020 in Journal of Intelligent Material Systems and Structures
Verified
Journal Article
Closed access
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SSShalini Singh
Shalini Singh
Karthick SubramaniamKarthick Subramaniam
Karthick Subramaniam
NCNishita Chittora
Nishita Chittora
ABA Brolin
A Brolin
IPIa Palani
Ia Palani
Shape memory alloy coating on an optical fiber plays an important role in developing novel active thermal sensors in the field of microelectromechanical systems. In this article, a detailed analysis of NiTi alloy deposited over plastic optical fiber was discussed. A detailed investigation of the morphological, structural, and thermal properties of the NiTi-coated optic fiber was conducted. The uniformity, crystallinity, transformation temperatures, and thermal stability of the coatings were measured using differential scanning calorimetry, scanning electron microscopy, X-ray diffraction, and thermogravimetric analysis, respectively. Also, an electrical actuation setup thermo-mechanical test was conducted through Joule heating in which different voltages at varying loads have been used. The sensor characteristic–based parameters (time response and sensitivity) were also calculated. The article presents a complete analysis of experimental results showing the properties and performances of the plastic optical fiber after coating with shape memory alloy.

22 February 2024 in Materials
Verified
Journal Article
Open access
PDF file
SSShalini Singh
Shalini Singh
EDElena Demidova
Elena Demidova
NRNatalia Resnina
Natalia Resnina
SBSergey Belyaev
Sergey Belyaev
PIPalani I.A.
Palani I.A.
Prashanth Konda GokuldossPrashanth Konda Gokuldoss
Prashanth Konda Gokuldoss
This study endeavors to comprehensively explore and elucidate the seamless integration of NiTi shape memory alloys (SMAs) into multifaceted applications through the utilization of novel joining techniques. The primary focus lies in the utilization of wire arc additive manufacturing (WAAM) to deposit Nitinol (NiTi) onto Copper (Cu), thereby introducing a transformative approach for their integration into electro-mechanical systems and beyond. Through a detailed examination of the NiTi/Cu bimetallic junction, using advanced analytical techniques including SEM, XRD, and DSC analyses, this research aims to unravel the intricate complexities inherent within the interface. The SEM images and X-ray patterns obtained reveal a complex and nuanced interface characterized by a broad mixed zone comprising various constituents, including Ti(Ni,Cu)2, pure Cu, Ti2(Ni,Cu)3 precipitates, and Ni-rich NiTi precipitates. The DSC results, showcasing low-intensity broad peaks during thermal cycling, underscore the inherent challenges in demonstrating functional properties within the NiTi/Cu system. Recognizing the critical importance of an enhanced martensitic transformation, this study delves into the effects of heat treatment. Calorimetric curves post-annealing at 500 °C exhibit distinct transformation peaks, shedding light on the intricate influence of NiTi layer distribution within the junction. The optimal heat treatment parameters for NiTi/Cu junction restoration are meticulously explored and determined at 500 °C for a duration of 12 h. Furthermore, the study offers valuable insights into optimizing NiTi–Cu joints, with micro-hardness values reaching 485 HV and compressive strength scaling up to 650 MPa. These significant findings not only hold promise for diverse applications across various industries but also pave the way for further research directions and explorations into the realm of SMA integration and advanced joining methodologies.