This research focused on extending the applications of fused deposition modeling (FDM) by extrusion and deposition of low melting temperature metal alloys to create three-dimensional metal structures and single-layer contacts which may prove useful for electronic interconnects. Six commercially available low melting temperature solder alloys (Bi36Pb32Sn31Ag1, Bi58Sn42, Sn63Pb37, Sn50Pb50, Sn60Bi40, Sn96.5Ag3.5) were tested for the creation of a fused deposition modeling for metals (FDMm) system with special attention given to Sn–Bi solders. An existing FDM 3000 was used and two alloys were successfully extruded through the system's extrusion head. Deposition was achieved through specific modifications to system toolpath commands and a comparison of solders with eutectic and non-eutectic compositions is discussed. The modifications demonstrate the ability to extrude simple single-layer solder lines with varying thicknesses, including sharp 90 deg angles and smooth curved lines and showing the possibility of using this system for printed circuit board applications in which various connections need to be processed. Deposition parameters altered for extrusion and the deposition results of low melting temperature metal alloys are introduced.

An essentially fully acicular alpha-prime martensite within an equiaxed grain structure was produced in an Electron Beam Melting (EBM)-fabricated Ti-6Al-2Sn-4Zr-2Mo (Ti6242) alloy using two different Arcam EBM machines: An A2X system employing tungsten filament thermionic electron emission, and a Q20 system employing LaB6 thermionic electron emission. Post-process Hot Isostatic Pressing (HIP) treatment for 2 h at 850, 950, and 1050 °C resulted in grain refinement and equiaxed grain growth along with alpha-prime martensite decomposition to form an intragranular mixture of acicular martensite and alpha at 850 °C, and acicular alpha phase at 950 and 150 °C, often exhibiting a Widmanstätten (basketweave) structure. The corresponding tensile yield stress and ultimate tensile strength (UTS) associated with the grain growth and acicular alpha evolution decreased from ~1 and ~1.1 GPa, respectively, for the as-fabricated Ti6242 alloy to ~0.8 and 0.9 GPa, respectively, for HIP at 1050 °C. The optimum elongation of ~15–16% occurred for HIP at 850 °C; for both EBM systems. Because of the interactive role played by equiaxed grain growth and the intragrain, acicular alpha microstructures, the hardness varied only by ~7% between 41 and 38 HRC.

This study examines and compares the microstructures, Vickers microindentation hardness, and mechanical properties for additively manufactured (AM) samples built by a variety of AM processes: wire arc AM (WAAM), electron beam powder bed fusion (EB-PBF), laser wire direct energy deposition (LW-DED), electron beam direct energy deposition (EB-DED), laser-powered direct energy deposition (LP-DED), and laser powder bed fusion (L-PBF). These AM process samples were post-processed and heat-treated by stress relief annealing at 1066 °C, HIP at 1163 °C, and solution annealing treatment at 1177 °C. The resulting microstructures and corresponding microindentation hardnesses were examined and compared with the as-built AM process microstructures and hardnesses. Fully heat-treated AM process samples were mechanically tested to obtain tensile properties and were also evaluated and compared. Principal findings in this study were that high-temperature heat treatment >1100 °C of AM process-built samples was dominant and exhibited recrystallized, equiaxed grains containing fcc {111} annealing twins and second phase particles independent of the AM process, in contrast to as-built columnar/dendritic structures. The corresponding yield stress values ranged from 285 MPa to 371 MPa, and elongations ranged from 52% to 70%, respectively. Vickers microindentation hardnesses (HV) over this range of heat-treated samples varied from HV 190 to HV 220, in contrast to the as-built samples, which varied from HV 191 to HV 304.

Inconel 718 alloy fabricated by selective laser melting (SLM) (or laser powder-bed fusion (LPBF)) has been post-process heat-treated by stress-relief anneal at 1065 °C; stress-relief anneal (1065 °C) + solution treatment (at 720 °C) + aging (at 620 °C); hot isostatic pressing (HIP) (at 1120–1200 °C); stress-relief anneal + HIP; and stress-relief anneal + HIP + solution treatment + aging. Microstructure analysis utilizing optical metallography revealed primarily equiaxed grain structures (having average diameters ranging from ~30 to 49 microns) containing annealing twins, and a high concentration of carbide precipitates in all HIP-related treatments in the grain boundaries and intragrain regions. However, no precipitates nucleated on the {111} coherent annealing twin boundaries because of their very low interfacial free energy in contrast to regular grain boundaries. The mechanical properties for the as-fabricated Inconel 718 exhibited a yield stress of 0.64 GPa, UTS of 0.98 GPa, and elongation of 26%. Following stress-relief anneal at 1065 °C, the yield stress dropped to 0.60 GPa, while the elongation increased to 43%. The associated grain structure was an irregular, somewhat elongated, recrystallized structure. This structure was preserved at a stress anneal at 1065 °C + solution treatment + aging, but grain boundary and intragrain precipitation resulted in a doubling of the yield stress to 1.3 GPa and a reduced elongation of 12.6%. The results of HIP-related post-process heat treatments involving temperatures above 1060 °C demonstrated that the yield stress and elongations could be varied from 1.07 to 1.17 GPa and 11.4% to 19%, respectively. Corresponding Rockwell C-scale hardness values also varied from 33 for the as-fabricated Inconel 718 to 53 for simple post-process HIP treatment at 1163 °C.