In this paper, a new style of micro-structured LED (light-emitting diode) diffusion plate was developed using a highly efficient and precise hybrid processing method combined with micro injection molding and micro-grinding technology to realize mass production and low-cost manufacturing of LED lamps with excellent lighting performance. Firstly, the micro-structured mold core with controllable shape accuracy and surface quality was machined by the precision trued V-tip grinding wheel. Then, the micro-structured LED diffusion plate was rapidly fabricated by the micro injection molding technology. Finally, the influences of micro injection molding process parameters on the illumination of the micro-structured diffusion plate were investigated. The simulated optical results show that the illumination of the micro-structured diffusion plate can achieve a maximum value when the V-groove depth and V-groove angle are designed to be 300 μm and 60°, respectively. The experimental results indicate that the developed micro-structured diffusion plate may improve the illumination by about 40.82% compared with the traditional diffusion plate. The prediction accuracy of the designed light efficiency simulation method was about 90.33%.

In this paper, in view of low grinding efficiency and poor ground surface quality of sapphire glass, the coarse diamond grinding wheel dressed by dry impulse electrical discharge was proposed to perform efficient and precise grinding machining of sapphire glass. The dry electrical discharge dressing technology was employed to obtain high grain protrusion and sharp micro-grain cutting edges. The influences of grinding process parameters such as wheel speed, depth of cut and feed speed on the ground surface quality, grinding force and grinding force ratio on sapphire glass were investigated, and the relationship between grinding force and ground surface quality was also revealed. The experimental results show that the grain protrusion height on the surface of a coarse diamond grinding wheel dressed by dry electrical discharge can reach 168.5 µm. The minimum line roughness R_a and surface roughness S_a of ground sapphire glass surface were 0.194 µm and 0.736 µm, respectively. In order to achieve highly efficient ground quality of sapphire glass, the depth of cut was controlled within 7 µm, and the wheel speed and feed speed were 3000–5000 r/min and 10–20 mm/min, respectively. The influences of feed speed and wheel speed on grinding force ratio were more significant, but the influence of depth of cut was little.