Silicon dioxide nanoparticles, also known as silica nanoparticles or nanosilica, are the basis for a great deal of biomedical and catalytic research due to their stability, low toxicity and ability to be functionalized with a range of molecules and polymers. A novel synthesis route is based on CO₂ absorption/sequestration in an autoclave by forsterite (Mg₂SiO₄), which is part of the mineral group of olivines. Therefore, it is a feasible and safe method to bind carbon dioxide in carbonate compounds such as magnesite forming at the same time as the spherical particles of silica. Indifference to traditional methods of synthesis of nanosilica such as sol gel, ultrasonic spray pyrolysis method and hydrothermal synthesis using some acids and alkaline solutions, this synthesis method takes place in water solution at 175 °C and above 100 bar. Our first experiments have studied the influence of some additives such as sodium bicarbonate, oxalic acid and ascorbic acid, solid/liquid ratio and particle size on the carbonation efficiency, without any consideration of formed silica. This paper focuses on a carbonation mechanism for synthesis of nanosilica under high pressure and high temperature in an autoclave, its morphological characteristics and important parameters for silica precipitation such as pH-value and rotating speed.

Cu–Mo composites have been expected to be materials of heat sinks in electron devices. We have formed Cu–Mo composites by electrodeposition. Molybdenum content in Cu–Mo composites formed by using Na₂MoO₄ was larger than that in ones formed by using H₃(PMo₁₂O₄₀). Molybdenum content, over 30 wt % in Cu–Mo composites was obtained.

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We have been developing our original hydrolyzed sol-gel coating solutions for the SrBi₂Ta₂O₉ (SBT) thin film. The molecular structure of the solution can be controlled by hydrolysis. We studied the SBT thin film forming process using these coating solutions with the steam curing process used together and observed lower crystallization temperature and improvement of crystal orientation.

When a passive component electrode is metalized, conventional barrel electrolytic plating is used. However, as the size of the component becomes smaller, it is difficult to perform plating uniformly. In order to solve this problem, we carried out electroless plating, achieving selective electroless deposition on the metallic electrodes of the micro passive chip component.