A lab-on-a-chip (LOC)-based non-invasive optical sensor for measuring glucose in saliva was fabricated. Existing glucose sensors utilizing blood require acquisition of a blood sample by pricking the finger, which is painful and inconvenient. To overcome these limitations, we propose a non-invasive glucose sensor with LOC, micro-electro-mechanical system and optical measurement technology. The proposed sensor for measuring glucose in saliva involves pretreatment, mixing, and measurement on a single tiny chip. Saliva containing glucose and glucose oxidase for glucose oxidation are injected through Inlets 1 and 2, respectively. Next, H₂O₂ is produced by the reaction between glucose and glucose oxidase in the pretreatment part. The saliva and generated H₂O₂ are mixed with a colorizing agent injected through Inlet 3 during the mixing part and the absorbance of the colorized mixture is measured in the measurement part. The absorbance of light increases as a function of glucose concentration at a wavelength of 630 nm. To measure the absorbance of the colorized saliva, a light-emitting diode with a wavelength of 630 nm and a photodiode were used during the measurement part. As a result, the measured output current of the photodiode decreased as glucose concentration in the saliva increased.

Die attach is a typical process that induces thermal stress in the fabrication of microelectromechanical system (MEMS) devices. One solution to this problem is attaching a portion of the die to the package. In such partial die bonding, the lack of control over the spreading of the adhesive can cause non-uniform attachment. In this case, asymmetric packaging stress could be generated and transferred to the die. The performance of MEMS devices, which employ the differential outputs of the sensing elements, is directly affected by the asymmetric packaging stress. In this paper, we proposed a die-attach structure with a pillar to reduce the asymmetric packaging stress and the changes in packaging stress due to changes in the device temperature. To verify the proposed structure, we fabricated four types of differential resonant accelerometers (DRA) with the silicon-on-glass process. We confirmed experimentally that the pillar can control the spreading of the adhesive and that the asymmetric packaging stress is considerably reduced. The simulation and experimental results indicated that the DRAs manufactured using glass-on-silicon wafers as handle substrates instead of conventional glass wafers have a structure that compensates for the thermal stress.

A tunable Fabry-Perot interferometer (TFPI)-type wavelength filter designed for the long-wavelength infrared (LWIR) region is fabricated using micro electro mechanical systems (MEMS) technology and the novel polydimethylsiloxane (PDMS) micro patterning technique. The structure of the proposed infrared sensor consists of a Fabry-Perot interferometer (FPI)-based optical filter and infrared (IR) detector. An amorphous Si-based thermal IR detector is located under the FPI-based optical filter to detect the IR-rays filtered by the FPI. The filtered IR wavelength is selected according to the air etalon gap between reflectors, which is defined by the thickness of the patterned PDMS. The 8 μm-thick PDMS pattern is fabricated on a 3 nm-thick Al layer used as a reflector. The air etalon gap is changed using the electromagnetic force between the permanent magnet and solenoid. The measured PDMS gap height is about 2 μm, ranging from 8 μm to 6 μm, with driving current varying from 0 mA to 600 mA, resulting in a tunable wavelength range of 4 μm. The 3-dB bandwidth (full width at half maximum, FWHM) of the proposed filter is 1.5 nm, while the Free Spectral Range (FSR) is 8 μm. Experimental results show that the proposed TFPI can detect a specific wavelength at the long LWIR region.